Tomohiro IGUCHI

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,965
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,080,680
- Issue date Sep 3, 2024
- Kabushiki Kaisba Toshiba
- Makoto Mizukami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,892
- Issue date Oct 3, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,605,613
- Issue date Mar 14, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,462,508
- Issue date Oct 4, 2022
- Kabushiki Kaisha Toshiba
- Makoto Mizukami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,081,412
- Issue date Aug 3, 2021
- Kabushiki Kaisha Toshiba
- Takenori Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor element with improved yield
- Patent number 10,727,209
- Issue date Jul 28, 2020
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor chip, semiconductor chip, and...
- Patent number 10,410,976
- Issue date Sep 10, 2019
- Kabushiki Kaisha Toshiba
- Yusaku Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,199,365
- Issue date Feb 5, 2019
- Kabushiki Kaisha Toshiba
- Akiya Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor chip, semiconductor chip, and...
- Patent number 9,460,967
- Issue date Oct 4, 2016
- Kabushiki Kaisha Toshiba
- Yusaku Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing same
- Patent number 9,202,757
- Issue date Dec 1, 2015
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,975,732
- Issue date Mar 10, 2015
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating semiconductor device
- Patent number 8,378,479
- Issue date Feb 19, 2013
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device and method of manufacturing optical se...
- Patent number 8,241,937
- Issue date Aug 14, 2012
- Kabushiki Kaisha Toshiba
- Akihiko Happoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 8,193,643
- Issue date Jun 5, 2012
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device and method of manufacturing optical se...
- Patent number 8,039,857
- Issue date Oct 18, 2011
- Kabushiki Kaisha Toshiba
- Akihiko Happoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating semiconductor device
- Patent number 8,008,773
- Issue date Aug 30, 2011
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,656,034
- Issue date Feb 2, 2010
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a thermoelectric device
- Patent number 7,278,199
- Issue date Oct 9, 2007
- Kabushiki Kaisha Toshiba
- Kazuki Tateyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor wafer and method of manufactu...
- Patent number 7,205,239
- Issue date Apr 17, 2007
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric device
- Patent number 7,024,865
- Issue date Apr 11, 2006
- Kabushiki Kaisha Toshiba
- Kazuki Tateyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a plurality of stacked wiring boards
- Patent number 6,528,870
- Issue date Mar 4, 2003
- Kabushiki Kaisha Toshiba
- Kenta Fukatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...
- Publication number 20240355693
- Publication date Oct 24, 2024
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230395485
- Publication date Dec 7, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20230299038
- Publication date Sep 21, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230092229
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230078259
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Yuchen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220415848
- Publication date Dec 29, 2022
- Kabushiki Kaisha Toshiba
- Makoto MIZUKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210351161
- Publication date Nov 11, 2021
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305204
- Publication date Sep 30, 2021
- Kabushiki Kaisha Toshiba
- Makoto MIZUKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305147
- Publication date Sep 30, 2021
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210082781
- Publication date Mar 18, 2021
- Kabushiki Kaisha Toshiba
- Takenori Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ELEMENT
- Publication number 20190035770
- Publication date Jan 31, 2019
- KABUSHIKI KAISHA TOSHIBA
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180308833
- Publication date Oct 25, 2018
- KABUSHIKI KAISHA TOSHIBA
- Akihiro Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180226389
- Publication date Aug 9, 2018
- KABUSHIKI KAISHA TOSHIBA
- Akiya KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20170170150
- Publication date Jun 15, 2017
- KABUSHIKI KAISHA TOSHIBA
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND MAGNETICSHIELD PACKAGE
- Publication number 20170050842
- Publication date Feb 23, 2017
- Kabushiki Kaisha Toshiba
- Keiju YAMADA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND...
- Publication number 20160358863
- Publication date Dec 8, 2016
- KABUSHIKI KAISHA TOSHIBA
- Yusaku ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE INCLUDING WIRING BOARD
- Publication number 20160190032
- Publication date Jun 30, 2016
- Kabushiki Kaisha Toshiba
- Kazuya Kodani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20160035657
- Publication date Feb 4, 2016
- KABUSHIKI KAISHA TOSHIBA
- Taizo TOMIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND...
- Publication number 20150130028
- Publication date May 14, 2015
- KABUSHIKI KAISHA TOSHIBA
- Yusaku ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20150076516
- Publication date Mar 19, 2015
- Kabushiki Kaisha Toshiba
- Yuuji HISAZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC PARTICLE PASTE, CURED PRODUCT USING SAME, AND SEMICONDUCTO...
- Publication number 20150069638
- Publication date Mar 12, 2015
- KABUSHIKI KAISHA TOSHIBA
- Daisuke HIRATSUKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE FABRICATION METHOD, POWER SEMICONDUCTOR...
- Publication number 20140284797
- Publication date Sep 25, 2014
- Kabushiki Kaisha Toshiba
- Yuuji HISAZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140264435
- Publication date Sep 18, 2014
- KABUSHIKI KAISHA TOSHIBA
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130241040
- Publication date Sep 19, 2013
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SE...
- Publication number 20110312110
- Publication date Dec 22, 2011
- KABUSHIKI KAISHA TOSHIBA
- Akihiko HAPPOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20110272817
- Publication date Nov 10, 2011
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT DIODE AND METHOD OF FABRICATING THE SAME
- Publication number 20110186982
- Publication date Aug 4, 2011
- Kabushiki Kaisha Toshiba
- Tomoyuki KITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE FOR ELECTRICAL INSPECTION, METHOD FOR FABRICATING THE SAME, A...
- Publication number 20100244869
- Publication date Sep 30, 2010
- Kabushiki Kaisha Toshiba
- Masayuki UCHIDA
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SE...
- Publication number 20100140639
- Publication date Jun 10, 2010
- Kabushiki Kaisha Toshiba
- Akihiko HAPPOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20100052142
- Publication date Mar 4, 2010
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS

Tomohiro IGUCHI

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device and semiconductor element with improved yield

Method of manufacturing semiconductor chip, semiconductor chip, and...

Semiconductor module

Metallic particle paste, cured product using same, and semiconducto...

Method of manufacturing semiconductor chip, semiconductor chip, and...

Semiconductor module and method for manufacturing same

Semiconductor device and method of manufacturing the same

Semiconductor device and method for fabricating semiconductor device

Optical semiconductor device and method of manufacturing optical se...

Semiconductor device and method for fabricating the same

Optical semiconductor device and method of manufacturing optical se...

Semiconductor device and method for fabricating semiconductor device

Semiconductor device and method for manufacturing the same

Method of making a thermoelectric device

Method of manufacturing semiconductor wafer and method of manufactu...

Thermoelectric device

Semiconductor device having a plurality of stacked wiring boards

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ELEMENT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

PRINTED WIRING BOARD AND MAGNETICSHIELD PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND...

WIRING BOARD AND SEMICONDUCTOR PACKAGE INCLUDING WIRING BOARD

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

METALLIC PARTICLE PASTE, CURED PRODUCT USING SAME, AND SEMICONDUCTO...

POWER SEMICONDUCTOR DEVICE FABRICATION METHOD, POWER SEMICONDUCTOR...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SE...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SURFACE MOUNT DIODE AND METHOD OF FABRICATING THE SAME

PROBE FOR ELECTRICAL INSPECTION, METHOD FOR FABRICATING THE SAME, A...

OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SE...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE