Tomohiro KUBO

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device including hammerhead-shaped word li...
- Patent number 12,094,943
- Issue date Sep 17, 2024
- SanDisk Technologies LLC
- Tomohiro Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with dielectric or semiconductor wa...
- Patent number 11,963,354
- Issue date Apr 16, 2024
- SanDisk Technologies LLC
- Tomohiro Kubo
Information Patent Grant
Three-dimensional memory device with dielectric wall support struct...
- Patent number 11,322,440
- Issue date May 3, 2022
- SanDisk Technologies LLC
- Tomohiro Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with drain-select-level isolation s...
- Patent number 10,748,927
- Issue date Aug 18, 2020
- SanDisk Technologies LLC
- Masanori Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with reduced etch damage to memory...
- Patent number 10,658,377
- Issue date May 19, 2020
- SanDisk Technologies LLC
- Tomohiro Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including inverted memory stack str...
- Patent number 10,381,362
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing through-memory-level con...
- Patent number 10,304,852
- Issue date May 28, 2019
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-semiconductor alloy region for enhancing on current in a thre...
- Patent number 9,524,977
- Issue date Dec 20, 2016
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL BRIDGE SUPPO...
- Publication number 20240395710
- Publication date Nov 28, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SILICON OXYCARBIDE LINER...
- Publication number 20240260266
- Publication date Aug 1, 2024
- SANDISK TECHNOLOGIES LLC
- Naohiro HOSODA
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING INTEGRATED CONTACT-AND-S...
- Publication number 20240213145
- Publication date Jun 27, 2024
- SANDISK TECHNOLOGIES LLC
- Masato MIYAMOTO
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...
- Publication number 20240215243
- Publication date Jun 27, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masanori TSUTSUMI
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUC...
- Publication number 20240196616
- Publication date Jun 13, 2024
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEANDERING DIE...
- Publication number 20240179904
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY-UNDULATING LAT...
- Publication number 20240064983
- Publication date Feb 22, 2024
- SANDISK TECHNOLOGIES LLC
- Takashi KASHIMURA
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SOURCE RAILS AND METHOD...
- Publication number 20230328976
- Publication date Oct 12, 2023
- SANDISK TECHNOLOGIES LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING HAMMERHEAD-SHAPED WORD LI...
- Publication number 20230246085
- Publication date Aug 3, 2023
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING STAIRLESS WORD LINE CONTA...
- Publication number 20220328413
- Publication date Oct 13, 2022
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC OR SEMICONDUCTOR WA...
- Publication number 20220102375
- Publication date Mar 31, 2022
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC WALL SUPPORT STRUCT...
- Publication number 20220102273
- Publication date Mar 31, 2022
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DRAIN-SELECT-LEVEL ISOLATION S...
- Publication number 20200251489
- Publication date Aug 6, 2020
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH REDUCED ETCH DAMAGE TO MEMORY...
- Publication number 20200006373
- Publication date Jan 2, 2020
- SANDISK TECHNOLOGIES LLC
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-SEMICONDUCTOR ALLOY REGION FOR ENHANCING ON CURRENT IN A THRE...
- Publication number 20160307908
- Publication date Oct 20, 2016
- SanDisk Technologies, Inc.
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS

Tomohiro KUBO

Person

Patents Grantslast 30 patents

Three-dimensional memory device including hammerhead-shaped word li...

Three-dimensional memory device with dielectric or semiconductor wa...

Three-dimensional memory device with dielectric wall support struct...

Three-dimensional memory device with drain-select-level isolation s...

Three-dimensional memory device with reduced etch damage to memory...

Three-dimensional memory device including inverted memory stack str...

Three-dimensional memory device containing through-memory-level con...

Metal-semiconductor alloy region for enhancing on current in a thre...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-LEVEL BRIDGE SUPPO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SILICON OXYCARBIDE LINER...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING INTEGRATED CONTACT-AND-S...

THREE-DIMENSIONAL MEMORY DEVICE WITH THROUGH-STACK CONTACT VIA STRU...

THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUC...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEANDERING DIE...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY-UNDULATING LAT...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SOURCE RAILS AND METHOD...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING HAMMERHEAD-SHAPED WORD LI...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING STAIRLESS WORD LINE CONTA...

THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC OR SEMICONDUCTOR WA...

THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC WALL SUPPORT STRUCT...

THREE-DIMENSIONAL MEMORY DEVICE WITH DRAIN-SELECT-LEVEL ISOLATION S...

THREE-DIMENSIONAL MEMORY DEVICE WITH REDUCED ETCH DAMAGE TO MEMORY...

METAL-SEMICONDUCTOR ALLOY REGION FOR ENHANCING ON CURRENT IN A THRE...