Tomohiro Okamura

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Miyagi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor device
- Patent number 8,071,415
- Issue date Dec 6, 2011
- Lapis Semiconductor Co., Ltd.
- Tomohiro Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,790,568
- Issue date Sep 7, 2010
- Oki Semiconductor Co., Ltd.
- Tomohiro Okamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of fabricating SOI wafer
- Publication number 20110117741
- Publication date May 19, 2011
- Oki Semiconductor Co., Ltd.
- Tomohiro Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating semiconductor device
- Publication number 20100248410
- Publication date Sep 30, 2010
- Oki Semiconductor Co., Ltd.
- Tomohiro Okamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor device
- Publication number 20080057668
- Publication date Mar 6, 2008
- Tomohiro Okamura
- H01 - BASIC ELECTRIC ELEMENTS