Membership
Tour
Register
Log in
Tomohiro Okazaki
Follow
Person
Beppu-shi, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor chip mounting method utilizing ultrasonic vibrations
Patent number
6,269,999
Issue date
Aug 7, 2001
Texas Instruments Incorporated
Tomohiro Okazaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Method for Mounting Flip Chip and Substrate Used Therein
Publication number
20100269333
Publication date
Oct 28, 2010
TEXAS INSTRUMENTS INCORPORATED
Mutsumi MASUMOTO
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Semiconductor device and bump formation method
Publication number
20040229425
Publication date
Nov 18, 2004
Katsumi Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and bump formation method
Publication number
20020149118
Publication date
Oct 17, 2002
Katsumi Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS