Tomohiro Yokochi

Person

Obu-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate for a semiconductor device having thermoplastic r...
- Patent number 7,378,745
- Issue date May 27, 2008
- NEC Electronics Corporation
- Akimori Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having colored outer layer
- Patent number 7,323,238
- Issue date Jan 29, 2008
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 7,188,412
- Issue date Mar 13, 2007
- Denso Corporation
- Yoshitarou Yazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board with embedded electri...
- Patent number 7,165,321
- Issue date Jan 23, 2007
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective film for base substrates of multi-layered board and meth...
- Patent number 7,061,599
- Issue date Jun 13, 2006
- Denso Corporation
- Tomohiro Yokochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of rigid-flexible printed circuit board and st...
- Patent number 7,036,214
- Issue date May 2, 2006
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 6,972,070
- Issue date Dec 6, 2005
- Denso Corporation
- Yoshitaro Yazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting structure of printed circuit boards
- Patent number 6,966,482
- Issue date Nov 22, 2005
- Denso Corporation
- Makoto Totani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of multilayer substrate
- Patent number 6,855,625
- Issue date Feb 15, 2005
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 6,713,687
- Issue date Mar 30, 2004
- Denso Corporation
- Yoshitarou Yazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with embedded electric device and method for m...
- Patent number 6,680,441
- Issue date Jan 20, 2004
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of multilayer substrate and multilayer substra...
- Patent number 6,667,443
- Issue date Dec 23, 2003
- Denso Corporation
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing a printed wiring b...
- Patent number 6,641,898
- Issue date Nov 4, 2003
- Denso Corporation
- Yoshitaro Yazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting method and connecting structure of printed circuit boards
- Patent number 6,527,162
- Issue date Mar 4, 2003
- Denso Corporation
- Makoto Totani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for interconnecting printed circuit boards and interconnecti...
- Patent number 6,449,836
- Issue date Sep 17, 2002
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTUR...
- Publication number 20220115283
- Publication date Apr 14, 2022
- DENSO CORPORATION
- Akihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE PROVIDED WITH SUBSTRATE ON WHICH ELECTR...
- Publication number 20200258805
- Publication date Aug 13, 2020
- Denso Corporation
- Tomohiro YOKOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180242464
- Publication date Aug 23, 2018
- Denso Corporation
- Kenichiro HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed board and manufacturing method thereof
- Publication number 20060068180
- Publication date Mar 30, 2006
- DENSO CORPORATION
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate for a semiconductor device, a fabrication method...
- Publication number 20060044735
- Publication date Mar 2, 2006
- NEC ELECTRONICS CORPORATION
- Akimori Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed wiring board with embedded electri...
- Publication number 20040091687
- Publication date May 13, 2004
- Koji Kondo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for manufacturing printed wiring board
- Publication number 20040066633
- Publication date Apr 8, 2004
- Yoshitarou Yazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a printed wiring board
- Publication number 20040052932
- Publication date Mar 18, 2004
- Yoshitaro Yazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protective film for base substrates of multi-layered board and meth...
- Publication number 20040037966
- Publication date Feb 26, 2004
- Tomohiro Yokochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of multilayer substrate
- Publication number 20030209796
- Publication date Nov 13, 2003
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of rigid-flexible printed circuit board and st...
- Publication number 20030173105
- Publication date Sep 18, 2003
- Koji Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting structure of printed circuit boards
- Publication number 20030098339
- Publication date May 29, 2003
- Makoto Totani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board with embedded electric device and method for m...
- Publication number 20020192442
- Publication date Dec 19, 2002
- Koji Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed wiring board and method of manufacturing a printed wiring b...
- Publication number 20020086145
- Publication date Jul 4, 2002
- Yoshitaro Yazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed wiring board and method for manufacturing printed wiring board
- Publication number 20020079135
- Publication date Jun 27, 2002
- Yoshitarou Yazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Manufacturing method of multilayer substrate and multilayer substra...
- Publication number 20020076903
- Publication date Jun 20, 2002
- Koji Kondo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Connecting method and connecting structure of printed circuit boards
- Publication number 20020014518
- Publication date Feb 7, 2002
- Makoto Totani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tomohiro Yokochi

Person

Patents Grantslast 30 patents

Package substrate for a semiconductor device having thermoplastic r...

Printed circuit board having colored outer layer

Method for manufacturing printed wiring board

Method for manufacturing printed wiring board with embedded electri...

Protective film for base substrates of multi-layered board and meth...

Manufacturing method of rigid-flexible printed circuit board and st...

Method of manufacturing a printed wiring board

Connecting structure of printed circuit boards

Manufacturing method of multilayer substrate

Printed wiring board and method for manufacturing printed wiring board

Printed wiring board with embedded electric device and method for m...

Manufacturing method of multilayer substrate and multilayer substra...

Printed wiring board and method of manufacturing a printed wiring b...

Connecting method and connecting structure of printed circuit boards

Method for interconnecting printed circuit boards and interconnecti...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTUR...

ELECTRONIC COMPONENT MODULE PROVIDED WITH SUBSTRATE ON WHICH ELECTR...

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Printed board and manufacturing method thereof

Package substrate for a semiconductor device, a fabrication method...

Method for manufacturing printed wiring board with embedded electri...

Method for manufacturing printed wiring board

Method of manufacturing a printed wiring board

Protective film for base substrates of multi-layered board and meth...

Manufacturing method of multilayer substrate

Manufacturing method of rigid-flexible printed circuit board and st...

Connecting structure of printed circuit boards

Printed wiring board with embedded electric device and method for m...

Printed wiring board and method of manufacturing a printed wiring b...

Printed wiring board and method for manufacturing printed wiring board

Manufacturing method of multilayer substrate and multilayer substra...

Connecting method and connecting structure of printed circuit boards