Tomomi Komura

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Utsunomiya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Hydrostatic pad pressure modulation in a simultaneous double side w...
- Patent number 8,712,575
- Issue date Apr 29, 2014
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and systems for adjusting operation of a wafer grinder usin...
- Patent number 8,145,342
- Issue date Mar 27, 2012
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Nanotopography control and optimization using feedback from warp data
- Patent number 7,930,058
- Issue date Apr 19, 2011
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Double side wafer grinder and methods for assessing workpiece nanot...
- Patent number 7,601,049
- Issue date Oct 13, 2009
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Hydrostatic Pad Pressure Modulation in a Simultaneous Double Side W...
- Publication number 20110237160
- Publication date Sep 29, 2011
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Methods and Systems For Adjusting Operation Of A Wafer Grinder Usin...
- Publication number 20110045740
- Publication date Feb 24, 2011
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
NANOTOPOGRAPHY CONTROL AND OPTIMIZATION USING FEEDBACK FROM WARP DATA
- Publication number 20080166948
- Publication date Jul 10, 2008
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING