Tomonori MIURA

Person

Saga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Double-sided wafer polishing method
- Patent number 11,772,231
- Issue date Oct 3, 2023
- Sumco Corporation
- Shunsuke Mikuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of double-side polishing semiconductor wafer
- Patent number 11,731,234
- Issue date Aug 22, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Method of producing carrier and method of polishing wafer
- Patent number 11,127,584
- Issue date Sep 21, 2021
- Sumco Corporation
- Shunsuke Mikuriya
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for double-side polishing of work
- Patent number 9,403,257
- Issue date Aug 2, 2016
- Sumco Corporation
- Tomonori Miura
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing silicon epitaxial wafer
- Patent number 8,999,061
- Issue date Apr 7, 2015
- Sumco Corporation
- Masayuki Ishibashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 8,870,627
- Issue date Oct 28, 2014
- Sumco Corporation
- Hiroto Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Conditioning method and conditioning apparatus for polishing pad fo...
- Patent number 8,579,679
- Issue date Nov 12, 2013
- Sumco Corporation
- Hiroto Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing epitaxial wafer
- Patent number 7,998,867
- Issue date Aug 16, 2011
- Sumco Corporation
- Kazushige Takaishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PRODUCING CARRIER AND METHOD OF POLISHING WAFER
- Publication number 20200365387
- Publication date Nov 19, 2020
- SUMCO CORPORATION
- Shunsuke MIKURIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DOUBLE-SIDE POLISHING SEMICONDUCTOR WAFER
- Publication number 20200039021
- Publication date Feb 6, 2020
- SUMCO CORPORATION
- Mami KUBOTA
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDED WAFER POLISHING METHOD
- Publication number 20190160627
- Publication date May 30, 2019
- SUMCO CORPORATION
- Shunsuke MIKURIYA
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING OF WORK
- Publication number 20150065010
- Publication date Mar 5, 2015
- SUMCO CORPORATION
- Tomonori MIURA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20120220200
- Publication date Aug 30, 2012
- Hiroto Fukushima
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING SILICON EPITAXIAL WAFER
- Publication number 20120090536
- Publication date Apr 19, 2012
- SUMCO CORPORATION
- Masayuki Ishibashi
- C30 - CRYSTAL GROWTH
Information Patent Application
GRINDING METHOD AND GRINDING APPARATUS FOR POLISHING PAD FOR USE IN...
- Publication number 20110065365
- Publication date Mar 17, 2011
- SUMCO CORPORATION
- Hiroto Fukushima
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING EPITAXIAL WAFER
- Publication number 20100261341
- Publication date Oct 14, 2010
- SUMCO CORPORATION
- Kazushige Takaishi
- C30 - CRYSTAL GROWTH
Information Patent Application
EPITAXIAL WAFER
- Publication number 20100237470
- Publication date Sep 23, 2010
- SUMCO CORPORATION
- Kazushige Takaishi
- C30 - CRYSTAL GROWTH

Tomonori MIURA

Person

Patents Grantslast 30 patents

Double-sided wafer polishing method

Method of double-side polishing semiconductor wafer

Method of producing carrier and method of polishing wafer

Apparatus and method for double-side polishing of work

Method for producing silicon epitaxial wafer

Polishing method and polishing apparatus

Conditioning method and conditioning apparatus for polishing pad fo...

Method for manufacturing epitaxial wafer

Patents Applicationslast 30 patents

METHOD OF PRODUCING CARRIER AND METHOD OF POLISHING WAFER

METHOD OF DOUBLE-SIDE POLISHING SEMICONDUCTOR WAFER

DOUBLE-SIDED WAFER POLISHING METHOD

APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING OF WORK

POLISHING METHOD AND POLISHING APPARATUS

METHOD FOR PRODUCING SILICON EPITAXIAL WAFER

GRINDING METHOD AND GRINDING APPARATUS FOR POLISHING PAD FOR USE IN...

METHOD FOR MANUFACTURING EPITAXIAL WAFER

EPITAXIAL WAFER