Tomoya Oohiraki

Person

Kitamoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing insulating circuit substrate with heat sink
- Patent number 11,735,434
- Issue date Aug 22, 2023
- Mitsubishi Materials Corporation
- Ryouhei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing power module substrate board and ceramic-co...
- Patent number 11,676,882
- Issue date Jun 13, 2023
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic-component-mounted module
- Patent number 11,476,127
- Issue date Oct 18, 2022
- Mitsubishi Materials Corporation
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink-attached power module substrate board and power module
- Patent number 11,355,415
- Issue date Jun 7, 2022
- Mitsubishi Materials Corporation
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulation circuit board with heat sink
- Patent number 11,322,424
- Issue date May 3, 2022
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component-mounted module design to reduce linear expansi...
- Patent number 11,315,868
- Issue date Apr 26, 2022
- Mitsubishi Materials Corporation
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulation circuit board with heat sink
- Patent number 11,289,390
- Issue date Mar 29, 2022
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,289,400
- Issue date Mar 29, 2022
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joined body manufacturing method, multilayer joined body manufactur...
- Patent number 10,607,915
- Issue date Mar 31, 2020
- Mitsubishi Materials Corporation
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-sink-attached power-module substrate and power module
- Patent number 10,453,772
- Issue date Oct 22, 2019
- Mitsubishi Materials Corporation
- Tomoya Oohiraki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power-module substrate with cooler and method of producing the same
- Patent number 10,211,068
- Issue date Feb 19, 2019
- Mitsubishi Materials Corporation
- Sotaro Oi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power-module substrate unit and power module
- Patent number 10,068,829
- Issue date Sep 4, 2018
- Mitsubishi Materials Corporation
- Sotaro Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing power-module substrate with heat-sink
- Patent number 10,032,648
- Issue date Jul 24, 2018
- Mitsubishi Materials Corporation
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-module substrate unit and power module
- Patent number 9,837,363
- Issue date Dec 5, 2017
- Mitsubishi Materials Corporation
- Sotaro Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power-module substrate
- Patent number 9,579,739
- Issue date Feb 28, 2017
- Mitsubishi Materials Corporation
- Tomoya Oohiraki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INSULATION CIRCUIT BOARD WITH HEAT SINK
- Publication number 20220223493
- Publication date Jul 14, 2022
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20220173010
- Publication date Jun 2, 2022
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING INSULATING CIRCUIT SUBSTRATE WITH HEAT SINK
- Publication number 20210134609
- Publication date May 6, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryouhei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CIRCUIT BOARD WITH HEAT SINK
- Publication number 20210118769
- Publication date Apr 22, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryohei YUMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
HEAT SINK-ATTACHED POWER MODULE SUBSTRATE BOARD AND POWER MODULE
- Publication number 20210074607
- Publication date Mar 11, 2021
- MITSUBISHI MATERIALS CORPORATION
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING POWER MODULE SUBSTRATE BOARD AND CERAMIC-CO...
- Publication number 20210050278
- Publication date Feb 18, 2021
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20210028086
- Publication date Jan 28, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CIRCUIT BOARD WITH HEAT SINK
- Publication number 20210020530
- Publication date Jan 21, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC-COMPONENT-MOUNTED MODULE
- Publication number 20210020456
- Publication date Jan 21, 2021
- MITSUBISHI MATERIALS CORPORATION
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT-MOUNTED MODULE
- Publication number 20210005544
- Publication date Jan 7, 2021
- MITSUBISHI MATERIALS CORPORATION
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED CIRCUIT BOARD
- Publication number 20200413534
- Publication date Dec 31, 2020
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-SINK-ATTACHED POWER-MODULE SUBSTRATE AND POWER MODULE
- Publication number 20180301391
- Publication date Oct 18, 2018
- MITSUBISHI MATERIALS CORPORATION
- Tomoya Oohiraki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POWER-MODULE SUBSTRATE WITH COOLER AND METHOD OF PRODUCING THE SAME
- Publication number 20170309499
- Publication date Oct 26, 2017
- MITSUBISHI MATERIALS CORPORATION
- Sotaro Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCING METHOD OF POWER-MODULE SUBSTRATE
- Publication number 20170229320
- Publication date Aug 10, 2017
- MITSUBISHI MATERIALS CORPORATION
- Tomoya Oohiraki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER-MODULE SUBSTRATE UNIT AND POWER MODULE
- Publication number 20170154855
- Publication date Jun 1, 2017
- MITSUBISHI MATERIALS CORPORATION
- Sotaro Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINED BODY MANUFACTURING METHOD, MULTILAYER JOINED BODY MANUFACTUR...
- Publication number 20170141011
- Publication date May 18, 2017
- MITSUBISHI MATERIALS CORPORATION
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-MODULE SUBSTRATE UNIT AND POWER MODULE
- Publication number 20170053852
- Publication date Feb 23, 2017
- MITSUBISHI MATERIALS CORPORATION
- Sotaro Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-MODULE SUBSTRATE WITH HEAT-SINK AND MANUFACTURING METHOD THEREOF
- Publication number 20160254209
- Publication date Sep 1, 2016
- MITSUBISHI MATERIALS CORPORATION
- Tomoya Oohiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF POWER-MODULE SUBSTRATE
- Publication number 20160001388
- Publication date Jan 7, 2016
- Mitsubishi Materials Corporation
- Tomoya Oohiraki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Tomoya Oohiraki

Person

Patents Grantslast 30 patents

Method of manufacturing bonded body for insulation circuit substrat...

Method for producing insulating circuit substrate with heat sink

Method of manufacturing power module substrate board and ceramic-co...

Manufacturing method of electronic-component-mounted module

Heat sink-attached power module substrate board and power module

Insulation circuit board with heat sink

Electronic-component-mounted module design to reduce linear expansi...

Insulation circuit board with heat sink

Method of manufacturing bonded body for insulation circuit substrat...

Joined body manufacturing method, multilayer joined body manufactur...

Heat-sink-attached power-module substrate and power module

Power-module substrate with cooler and method of producing the same

Power-module substrate unit and power module

Method of manufacturing power-module substrate with heat-sink

Power-module substrate unit and power module

Manufacturing method of power-module substrate

Patents Applicationslast 30 patents

INSULATION CIRCUIT BOARD WITH HEAT SINK

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

METHOD FOR PRODUCING INSULATING CIRCUIT SUBSTRATE WITH HEAT SINK

INSULATION CIRCUIT BOARD WITH HEAT SINK

HEAT SINK-ATTACHED POWER MODULE SUBSTRATE BOARD AND POWER MODULE

METHOD OF MANUFACTURING POWER MODULE SUBSTRATE BOARD AND CERAMIC-CO...

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

INSULATION CIRCUIT BOARD WITH HEAT SINK

MANUFACTURING METHOD OF ELECTRONIC-COMPONENT-MOUNTED MODULE

ELECTRONIC-COMPONENT-MOUNTED MODULE

INSULATED CIRCUIT BOARD

HEAT-SINK-ATTACHED POWER-MODULE SUBSTRATE AND POWER MODULE

POWER-MODULE SUBSTRATE WITH COOLER AND METHOD OF PRODUCING THE SAME

PRODUCING METHOD OF POWER-MODULE SUBSTRATE

POWER-MODULE SUBSTRATE UNIT AND POWER MODULE

JOINED BODY MANUFACTURING METHOD, MULTILAYER JOINED BODY MANUFACTUR...

POWER-MODULE SUBSTRATE UNIT AND POWER MODULE

POWER-MODULE SUBSTRATE WITH HEAT-SINK AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF POWER-MODULE SUBSTRATE