Tomoyuki Fujinami

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Kanagawa-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Microporous copper film and electroless copper plating solution for...
- Patent number 6,329,072
- Issue date Dec 11, 2001
- Ebara-Udylite Co., Ltd.
- Hideo Honma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution and method for electroless copp...
- Patent number 6,193,789
- Issue date Feb 27, 2001
- Ebara-Udylite Co., Ltd.
- Hideo Honma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Microporous copper film and electroless copper plating solution for...
- Publication number 20020046679
- Publication date Apr 25, 2002
- Hideo HONMA
- Hideo Honma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...