TREA

Tomoyuki Ikeda

Follow

Person

  • Ibi-gun, JP
People

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20230069980
    • Publication date Mar 9, 2023
    • IBIDEN CO., LTD.
    • Tomoyuki IKEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230076560
    • Publication date Mar 9, 2023
    • IBIDEN CO., LTD.
    • Keisuke SHIMIZU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220404564
    • Publication date Dec 22, 2022
    • IBIDEN CO., LTD.
    • Keisuke SHIMIZU
    • G02 - OPTICS
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20220377884
    • Publication date Nov 24, 2022
    • IBIDEN CO., LTD.
    • Shigeto IYODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20220377883
    • Publication date Nov 24, 2022
    • IBIDEN CO., LTD.
    • Shigeto IYODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20220369456
    • Publication date Nov 17, 2022
    • IBIDEN CO., LTD.
    • Tomoyuki IKEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20220223532
    • Publication date Jul 14, 2022
    • IBIDEN CO., LTD.
    • Tomoyuki IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20210045238
    • Publication date Feb 11, 2021
    • IBIDEN CO., LTD.
    • Shigemitsu KUNIKANE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20200389969
    • Publication date Dec 10, 2020
    • IBIDEN CO., LTD.
    • Tomoyuki IKEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
    • Publication number 20160316566
    • Publication date Oct 27, 2016
    • IBIDEN CO., LTD.
    • Kenji SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    • Publication number 20150216055
    • Publication date Jul 30, 2015
    • IBIDEN CO., LTD.
    • Tomoyuki IKEDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    MULTILAYER PRINTED WIRING BOARD
    • Publication number 20130008701
    • Publication date Jan 10, 2013
    • IBIDEN CO., LTD.
    • Yukihiko TOYODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Printed Wiring Board And A Method Of Production Thereof
    • Publication number 20120175155
    • Publication date Jul 12, 2012
    • IBIDEN, CO., LTD.
    • Tomoyuki IKEDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
    • Publication number 20120012464
    • Publication date Jan 19, 2012
    • IBIDEN CO., LTD.
    • Tomoyuki IKEDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    MULTILAYERED PRINTED WIRING BOARD
    • Publication number 20110247208
    • Publication date Oct 13, 2011
    • IBIDEN CO., LTD.
    • Tomoyuki Ikeda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER PRINTED WIRING BOARD
    • Publication number 20110108311
    • Publication date May 12, 2011
    • IBIDEN CO., LTD.
    • Yukihiko TOYODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
    • Publication number 20100155112
    • Publication date Jun 24, 2010
    • IBIDEN, CO., LTD.
    • Tomoyuki IKEDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
    • Publication number 20100089632
    • Publication date Apr 15, 2010
    • IBIDEN, CO., LTD.
    • Tomoyuki IKEDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
    • Publication number 20080257591
    • Publication date Oct 23, 2008
    • IBIDEN, CO., LTD.
    • Tomoyuki IKEDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    MULTILAYER PRINTED WIRING BOARD
    • Publication number 20080190658
    • Publication date Aug 14, 2008
    • IBIDEN CO., LTD.
    • Yukihiko TOYODA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYERED PRINTED WIRING BOARD
    • Publication number 20080107863
    • Publication date May 8, 2008
    • IBIDEN CO., LTD.
    • Tomoyuki Ikeda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER CORE BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20070271783
    • Publication date Nov 29, 2007
    • IBIDEN CO., LTD.
    • Tomoyuki Ikeda
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Multilayer core board and manufacturing method thereof
    • Publication number 20060083895
    • Publication date Apr 20, 2006
    • IBIDEN CO., LTD.
    • Tomoyuki Ikeda
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    Multilayered printed wiring board
    • Publication number 20030178229
    • Publication date Sep 25, 2003
    • Yukihiko Toyoda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR