Tongbi T. Jiang

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blood pressure monitoring system including a liquid filled sensor
- Patent number 12,251,204
- Issue date Mar 18, 2025
- Apple Inc.
- Caleb C. Han
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Optical sensor package with magnetic component for device attachment
- Patent number 12,074,244
- Issue date Aug 27, 2024
- Apple Inc.
- Saijin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for magnetic barrier assembly
- Patent number 11,917,773
- Issue date Feb 27, 2024
- Apple, Inc.
- Saijin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic devices with non-rectangular die shapes
- Patent number 11,646,384
- Issue date May 9, 2023
- Apple Inc.
- Mathieu Charbonneau-Lefort
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 11,594,525
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable electronic device with fluid-based pressure sensing
- Patent number 11,561,144
- Issue date Jan 24, 2023
- Apple Inc.
- Caleb C. Han
- G01 - MEASURING TESTING
Information Patent Grant
Exposed wire-bonding for sensing liquid and water in electronic dev...
- Patent number 11,422,104
- Issue date Aug 23, 2022
- Apple Inc.
- Caleb C. Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 11,398,457
- Issue date Jul 26, 2022
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 11,217,556
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-mountable semiconductor chip package
- Patent number 11,211,515
- Issue date Dec 28, 2021
- Apple Inc.
- Tongbi T. Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level optical module
- Patent number 10,993,317
- Issue date Apr 27, 2021
- Apple Inc.
- Yinjuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level optical module
- Patent number 10,811,400
- Issue date Oct 20, 2020
- Apple Inc.
- Yinjuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 10,593,653
- Issue date Mar 17, 2020
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
VCSEL structure with embedded heat sink
- Patent number 10,454,241
- Issue date Oct 22, 2019
- Apple Inc.
- Tongbi T. Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
VCSEL structure with embedded heat sink
- Patent number 10,103,512
- Issue date Oct 16, 2018
- Apple Inc.
- Tongbi T. Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 10,083,931
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Various stress free sensor packages using wafer level supporting di...
- Patent number 10,041,847
- Issue date Aug 7, 2018
- Apple Inc.
- Caleb C. Han
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
VCSEL structure with embedded heat sink
- Patent number 9,735,539
- Issue date Aug 15, 2017
- Apple Inc.
- Tongbi T. Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated MEMS microphone and vibration sensor
- Patent number 9,661,411
- Issue date May 23, 2017
- Apple Inc.
- Caleb C. Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of lower profile MEMS package with stress isolations
- Patent number 9,656,856
- Issue date May 23, 2017
- Apple Inc.
- Tongbi Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus of making MEMS packages
- Patent number 9,624,093
- Issue date Apr 18, 2017
- Apple Inc.
- Tongbi Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Various stress free sensor packages using wafer level supporting di...
- Patent number 9,574,959
- Issue date Feb 21, 2017
- Apple Inc.
- Caleb C. Han
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Preventing artifacts due to underfill in flip chip imager assembly
- Patent number 9,503,622
- Issue date Nov 22, 2016
- Apple Inc.
- Tongbi T. Jiang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of lower profile MEMS package with stress isolations
- Patent number 9,446,941
- Issue date Sep 20, 2016
- Apple Inc.
- Tongbi Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 9,240,385
- Issue date Jan 19, 2016
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 9,099,571
- Issue date Aug 4, 2015
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor array package
- Patent number 8,981,578
- Issue date Mar 17, 2015
- Matthew E. Last
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 8,922,002
- Issue date Dec 30, 2014
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SENSOR PACKAGE WITH MAGNETIC COMPONENT FOR DEVICE ATTACHMENT
- Publication number 20250048769
- Publication date Feb 6, 2025
- Apple Inc.
- Saijin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Display Systems Having Vertical Light-Emitting Diodes
- Publication number 20240170625
- Publication date May 23, 2024
- Apple Inc.
- Saijin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
- Publication number 20240145305
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor Module Having an Intermediate Pedestal on Which One or More...
- Publication number 20230384178
- Publication date Nov 30, 2023
- Apple Inc.
- Caleb C. Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Systems with Light-Emitting Diodes
- Publication number 20230361154
- Publication date Nov 9, 2023
- Apple Inc.
- Ziruo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Systems with Light-Emitting Diodes
- Publication number 20230361153
- Publication date Nov 9, 2023
- Apple Inc.
- Ziruo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20230197690
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MAGNETIC BARRIER ASSEMBLY
- Publication number 20230090608
- Publication date Mar 23, 2023
- Apple Inc.
- Saijin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fine Pitch Hybrid Bonding with Dissimilar CTE Wafers and...
- Publication number 20220336405
- Publication date Oct 20, 2022
- Apple Inc.
- Saijin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20220285325
- Publication date Sep 8, 2022
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICES WITH NON-RECTANGULAR DIE SHAPES
- Publication number 20220254941
- Publication date Aug 11, 2022
- Apple Inc.
- Mathieu Charbonneau-Lefort
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Blood Pressure Monitoring System Including a Liquid Filled Sensor
- Publication number 20220240803
- Publication date Aug 4, 2022
- Apple Inc.
- Caleb C. Han
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Sensor Package with Magnetic Component for Device Attachment
- Publication number 20220085231
- Publication date Mar 17, 2022
- Apple Inc.
- Saijin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Display Systems Having Monolithic Arrays of Light-Emitting Diodes
- Publication number 20220005798
- Publication date Jan 6, 2022
- Apple Inc.
- Jun Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
- Publication number 20210134674
- Publication date May 6, 2021
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED WIRE-BONDING FOR SENSING LIQUID AND WATER IN ELECTRONIC DEV...
- Publication number 20210072176
- Publication date Mar 11, 2021
- Apple Inc.
- Caleb C. Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20200279834
- Publication date Sep 3, 2020
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge-Mountable Semiconductor Chip Package
- Publication number 20200274020
- Publication date Aug 27, 2020
- Apple Inc.
- Tongbi T. Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL OPTICAL MODULE
- Publication number 20200107436
- Publication date Apr 2, 2020
- Apple Inc.
- Yinjuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL OPTICAL MODULE
- Publication number 20200107435
- Publication date Apr 2, 2020
- Apple Inc.
- Yinjuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VCSEL structure with embedded heat sink
- Publication number 20190181610
- Publication date Jun 13, 2019
- Apple Inc.
- Tongbi T. Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20180358324
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VCSEL structure with embedded heat sink
- Publication number 20180048115
- Publication date Feb 15, 2018
- Apple Inc.
- Tongbi T. Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MEMS MICROPHONE AND VIBRATION SENSOR
- Publication number 20170156002
- Publication date Jun 1, 2017
- Apple Inc.
- Caleb C. Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VARIOUS STRESS FREE SENSOR PACKAGES USING WAFER LEVEL SUPPORTING DI...
- Publication number 20170089783
- Publication date Mar 30, 2017
- Apple Inc.
- Caleb C. Han
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VCSEL STRUCTURE WITH EMBEDDED HEAT SINK
- Publication number 20170025815
- Publication date Jan 26, 2017
- Apple Inc.
- Tongbi T. Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF LOWER PROFILE MEMS PACKAGE WITH STRESS ISOLATIONS
- Publication number 20160340175
- Publication date Nov 24, 2016
- Apple Inc.
- Tongbi Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF LOWER PROFILE MEMS PACKAGE WITH STRESS ISOLATIONS
- Publication number 20160167949
- Publication date Jun 16, 2016
- Apple Inc.
- Tongbi Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS OF MAKING MEMS PACKAGES
- Publication number 20160137488
- Publication date May 19, 2016
- Apple Inc.
- Tongbi Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Tongbi T. Jiang

Person

Patents Grantslast 30 patents

Semiconductor components having conductive vias with aligned back s...

Blood pressure monitoring system including a liquid filled sensor

Optical sensor package with magnetic component for device attachment

Systems and methods for magnetic barrier assembly

Semiconductor components having conductive vias with aligned back s...

Optoelectronic devices with non-rectangular die shapes

Packaged integrated circuit devices with through-body conductive vi...

Wearable electronic device with fluid-based pressure sensing

Exposed wire-bonding for sensing liquid and water in electronic dev...

Packaged integrated circuit devices with through-body conductive vi...

Packaged microelectronic devices having stacked interconnect elemen...

Edge-mountable semiconductor chip package

Wafer level optical module

Wafer level optical module

Packaged integrated circuit devices with through-body conductive vi...

VCSEL structure with embedded heat sink

VCSEL structure with embedded heat sink

Packaged microelectronic devices having stacked interconnect elemen...

Various stress free sensor packages using wafer level supporting di...

VCSEL structure with embedded heat sink

Integrated MEMS microphone and vibration sensor

Method of lower profile MEMS package with stress isolations

Method and apparatus of making MEMS packages

Various stress free sensor packages using wafer level supporting di...

Preventing artifacts due to underfill in flip chip imager assembly

Method of lower profile MEMS package with stress isolations

Packaged microelectronic devices and methods for manufacturing pack...

Packaged integrated circuit devices with through-body conductive vi...

Sensor array package

Packaged microelectronic devices and methods for manufacturing pack...

Patents Applicationslast 30 patents

OPTICAL SENSOR PACKAGE WITH MAGNETIC COMPONENT FOR DEVICE ATTACHMENT

Display Systems Having Vertical Light-Emitting Diodes

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

Sensor Module Having an Intermediate Pedestal on Which One or More...

Display Systems with Light-Emitting Diodes

Display Systems with Light-Emitting Diodes

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

SYSTEMS AND METHODS FOR MAGNETIC BARRIER ASSEMBLY

Method of Fine Pitch Hybrid Bonding with Dissimilar CTE Wafers and...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

OPTOELECTRONIC DEVICES WITH NON-RECTANGULAR DIE SHAPES

Blood Pressure Monitoring System Including a Liquid Filled Sensor

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

Optical Sensor Package with Magnetic Component for Device Attachment

Display Systems Having Monolithic Arrays of Light-Emitting Diodes

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

EXPOSED WIRE-BONDING FOR SENSING LIQUID AND WATER IN ELECTRONIC DEV...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

Edge-Mountable Semiconductor Chip Package

WAFER LEVEL OPTICAL MODULE

WAFER LEVEL OPTICAL MODULE

VCSEL structure with embedded heat sink

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

VCSEL structure with embedded heat sink

INTEGRATED MEMS MICROPHONE AND VIBRATION SENSOR

VARIOUS STRESS FREE SENSOR PACKAGES USING WAFER LEVEL SUPPORTING DI...

VCSEL STRUCTURE WITH EMBEDDED HEAT SINK

METHOD OF LOWER PROFILE MEMS PACKAGE WITH STRESS ISOLATIONS

METHOD OF LOWER PROFILE MEMS PACKAGE WITH STRESS ISOLATIONS

METHOD AND APPARATUS OF MAKING MEMS PACKAGES