Tonny Kamphuis

Person

Lent, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 11,011,446
- Issue date May 18, 2021
- Nexperia B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of defects in wafer level chip scale package (WLCSP) devices
- Patent number 10,177,111
- Issue date Jan 8, 2019
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale semiconductor package
- Patent number 10,109,564
- Issue date Oct 23, 2018
- NXP B.V.
- Roelf Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink very-thin quad flat no-leads (HVQFN) package
- Patent number 9,953,903
- Issue date Apr 24, 2018
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and molding approaches therefor
- Patent number 9,842,776
- Issue date Dec 12, 2017
- NXP B.V.
- John Suman Nakka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maximizing potential good die per wafer, PGDW
- Patent number 9,798,228
- Issue date Oct 24, 2017
- NXP B.V.
- Hans Cobussen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Reduction of defects in wafer level chip scale package (WLCSP) devices
- Patent number 9,704,823
- Issue date Jul 11, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing defects in wafer level chip scale package (WLCSP) devices
- Patent number 9,466,585
- Issue date Oct 11, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual interface IC card components and method for manufacturing the...
- Patent number 9,424,507
- Issue date Aug 23, 2016
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Single inline no-lead semiconductor package
- Patent number 9,379,071
- Issue date Jun 28, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a double-cut for mechanical protection of a wafer-level chip...
- Patent number 9,245,804
- Issue date Jan 26, 2016
- NXP B.V.
- Christian Zenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of a wafer-level chip scale package (WLCSP)
- Patent number 9,196,537
- Issue date Nov 24, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated wafer-level chip scale (WLSCP) pedestal packaging
- Patent number 8,987,057
- Issue date Mar 24, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing the same
- Patent number 8,895,357
- Issue date Nov 25, 2014
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out chip scale package
- Patent number 8,679,963
- Issue date Mar 25, 2014
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out chip scale package
- Patent number 8,482,136
- Issue date Jul 9, 2013
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits on a wafer and methods for manufacturing integr...
- Patent number 8,349,708
- Issue date Jan 8, 2013
- NXP B.V.
- Heimo Scheucher
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE
- Publication number 20170372988
- Publication date Dec 28, 2017
- NXP B.V.
- ROELF GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND MOLDING APPROACHES THEREFOR
- Publication number 20170200646
- Publication date Jul 13, 2017
- NXP B.V.
- John Suman Nakka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20170179076
- Publication date Jun 22, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE
- Publication number 20170148697
- Publication date May 25, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN ROUTABLE QUAD FLAT NO-LEADS (QFN) PACKAGE
- Publication number 20170103939
- Publication date Apr 13, 2017
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAXIMIZING POTENTIAL GOOD DIE PER WAFER, PGDW
- Publication number 20170092636
- Publication date Mar 30, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK VERY-THIN QUAD FLAT NO-LEADS (HVQFN) PACKAGE
- Publication number 20170025334
- Publication date Jan 26, 2017
- NXP B.V.
- Leonardus Antonius Elisabeth van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20160276176
- Publication date Sep 22, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20160276306
- Publication date Sep 22, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Exposed-Heatsink Quad Flat No-Leads (QFN) Package
- Publication number 20160005680
- Publication date Jan 7, 2016
- NXP B.V.
- Emil Casey Israel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE WAFER-LEVEL CHIP-SCALE PACKAGES WITH IMPROVED BOARD-LEVEL...
- Publication number 20160005653
- Publication date Jan 7, 2016
- NXP B.V.
- Caroline Catharina Maria Beelen-Hendrikx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE INLINE NO-LEAD SEMICONDUCTOR PACKAGE
- Publication number 20150303156
- Publication date Oct 22, 2015
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE...
- Publication number 20150278673
- Publication date Oct 1, 2015
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING
- Publication number 20150162306
- Publication date Jun 11, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150069587
- Publication date Mar 12, 2015
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)
- Publication number 20140138855
- Publication date May 22, 2014
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP...
- Publication number 20140110842
- Publication date Apr 24, 2014
- NXP B.V.
- Christian ZENZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING
- Publication number 20140091458
- Publication date Apr 3, 2014
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20130273731
- Publication date Oct 17, 2013
- Jan GULPEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130264691
- Publication date Oct 10, 2013
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20110156237
- Publication date Jun 30, 2011
- NXP B.V.
- Jan Gulpen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS ON A WAFER AND METHODS FOR MANUFACTURING INTEGR...
- Publication number 20100181568
- Publication date Jul 22, 2010
- NXP B.V.
- Heimo Scheucher
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Tonny Kamphuis

Person

Patents Grantslast 30 patents

Semiconductor device and method of making a semiconductor device

Reduction of defects in wafer level chip scale package (WLCSP) devices

Wafer level chip scale semiconductor package

Heatsink very-thin quad flat no-leads (HVQFN) package

Integrated circuits and molding approaches therefor

Maximizing potential good die per wafer, PGDW

Reduction of defects in wafer level chip scale package (WLCSP) devices

Reducing defects in wafer level chip scale package (WLCSP) devices

Dual interface IC card components and method for manufacturing the...

Single inline no-lead semiconductor package

Using a double-cut for mechanical protection of a wafer-level chip...

Protection of a wafer-level chip scale package (WLCSP)

Encapsulated wafer-level chip scale (WLSCP) pedestal packaging

Integrated circuit and method of manufacturing the same

Fan-out chip scale package

Fan-out chip scale package

Integrated circuits on a wafer and methods for manufacturing integr...

Patents Applicationslast 30 patents

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUITS AND MOLDING APPROACHES THEREFOR

REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE

ULTRATHIN ROUTABLE QUAD FLAT NO-LEADS (QFN) PACKAGE

MAXIMIZING POTENTIAL GOOD DIE PER WAFER, PGDW

HEATSINK VERY-THIN QUAD FLAT NO-LEADS (HVQFN) PACKAGE

REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES

REDUCING DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES

Exposed-Heatsink Quad Flat No-Leads (QFN) Package

FLEXIBLE WAFER-LEVEL CHIP-SCALE PACKAGES WITH IMPROVED BOARD-LEVEL...

SINGLE INLINE NO-LEAD SEMICONDUCTOR PACKAGE

DUAL INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE...

ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME

PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)

USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP...

ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING

FAN-OUT CHIP SCALE PACKAGE

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME

FAN-OUT CHIP SCALE PACKAGE

INTEGRATED CIRCUITS ON A WAFER AND METHODS FOR MANUFACTURING INTEGR...