Tony Faraci

Person

Georgetown, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self-cleaning socket for microelectronic devices
- Patent number 7,491,069
- Issue date Feb 17, 2009
- Centipede Systems, Inc.
- Thomas H. Di Stefano
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with heat sink
- Patent number 7,166,914
- Issue date Jan 23, 2007
- Tessera, Inc.
- Thomas H. DiStefano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Components with releasable leads and methods of making releasable l...
- Patent number 6,541,845
- Issue date Apr 1, 2003
- Tessera, Inc.
- Masud Beroz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a connection to a microelectronic element
- Patent number 6,428,328
- Issue date Aug 6, 2002
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a connection to a microelectronic element
- Patent number 6,374,487
- Issue date Apr 23, 2002
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting multiple microelectronic elements with lead deformation
- Patent number 6,365,436
- Issue date Apr 2, 2002
- Tessera, Inc.
- Tony Faraci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making connections to a microelectronic device having bu...
- Patent number 6,286,205
- Issue date Sep 11, 2001
- Tessera, Inc.
- Anthony B. Faraci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor chip assembly
- Patent number 6,265,765
- Issue date Jul 24, 2001
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components with releasable leads and methods of making releasable l...
- Patent number 6,261,863
- Issue date Jul 17, 2001
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for engaging bump leads on a microelectronic device and meth...
- Patent number 6,202,297
- Issue date Mar 20, 2001
- Tessera, Inc.
- Anthony B. Faraci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low insertion force connector for microelectronic elements
- Patent number 6,200,143
- Issue date Mar 13, 2001
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting multiple microelectronic elements with lead deformation
- Patent number 6,147,400
- Issue date Nov 14, 2000
- Tessera, Inc.
- Tony Faraci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible connectors for microelectronic elements
- Patent number 6,086,386
- Issue date Jul 11, 2000
- Tessera, Inc.
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixtures and methods for lead bonding and deformation
- Patent number 6,080,603
- Issue date Jun 27, 2000
- Tessera, Inc.
- Thomas Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixtures and methods for lead bonding and deformation
- Patent number 5,913,109
- Issue date Jun 15, 1999
- Tessera, Inc.
- Thomas Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for engaging bump leads on a microelectronic device and meth...
- Patent number 5,810,609
- Issue date Sep 22, 1998
- Tessera, Inc.
- Anthony B. Faraci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting multiple microelectronic elements with lead deformation
- Patent number 5,798,286
- Issue date Aug 25, 1998
- Tessera, Inc.
- Tony Faraci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor chip assembly
- Patent number 5,688,716
- Issue date Nov 18, 1997
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package with heat sink
- Publication number 20040262742
- Publication date Dec 30, 2004
- Tessera, Inc.
- Thomas H. DiStefano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making a connection to a microelectronic element
- Publication number 20020016090
- Publication date Feb 7, 2002
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-out semiconductor chip assembly
- Publication number 20010022396
- Publication date Sep 20, 2001
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Components with releasable leads and methods of making releasable l...
- Publication number 20010006253
- Publication date Jul 5, 2001
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS

Tony Faraci

Person

Patents Grantslast 30 patents

Self-cleaning socket for microelectronic devices

Semiconductor package with heat sink

Components with releasable leads and methods of making releasable l...

Method of making a connection to a microelectronic element

Method of making a connection to a microelectronic element

Connecting multiple microelectronic elements with lead deformation

Method for making connections to a microelectronic device having bu...

Fan-out semiconductor chip assembly

Components with releasable leads and methods of making releasable l...

Socket for engaging bump leads on a microelectronic device and meth...

Low insertion force connector for microelectronic elements

Connecting multiple microelectronic elements with lead deformation

Flexible connectors for microelectronic elements

Fixtures and methods for lead bonding and deformation

Fixtures and methods for lead bonding and deformation

Socket for engaging bump leads on a microelectronic device and meth...

Connecting multiple microelectronic elements with lead deformation

Fan-out semiconductor chip assembly

Patents Applicationslast 30 patents

Semiconductor package with heat sink

Method of making a connection to a microelectronic element

Fan-out semiconductor chip assembly

Components with releasable leads and methods of making releasable l...