Tooru Kumamoto

Person

Kumamoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead forming apparatus and method of fabricating semiconductor device
- Patent number 8,196,445
- Issue date Jun 12, 2012
- Renesas Electronics Corporation
- Tooru Kumamoto
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Tilt inspection apparatus and method of inspecting tilt
- Patent number 7,933,006
- Issue date Apr 26, 2011
- Renesas Electronics Corporation
- Tooru Kumamoto
- G01 - MEASURING TESTING
Information Patent Grant
Lead cutter and method of fabricating semiconductor device
- Patent number 7,795,060
- Issue date Sep 14, 2010
- NEC Electronics Corporation
- Tooru Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead cutter and method of fabricating semiconductor device
- Patent number 7,757,375
- Issue date Jul 20, 2010
- NEC Electronics Corporation
- Tooru Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Die unit and method of manufacturing die unit
- Publication number 20110038979
- Publication date Feb 17, 2011
- NEC ELECTRONICS CORPORATION
- Tooru Kumamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Cutting machine and method of measuring clearance
- Publication number 20100018374
- Publication date Jan 28, 2010
- NEC ELECTRONICS CORPORATION
- Tooru KUMAMOTO
- G01 - MEASURING TESTING
Information Patent Application
Tilt inspection apparatus and method of inspecting tilt
- Publication number 20100020313
- Publication date Jan 28, 2010
- NEC ELECTRONICS CORPORATION
- Tooru KUMAMOTO
- G01 - MEASURING TESTING
Information Patent Application
Lead cutter and method of cutting lead
- Publication number 20090255389
- Publication date Oct 15, 2009
- NEC Electronics Corporation
- Tooru Kumamoto
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
LEAD FORMING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20090093086
- Publication date Apr 9, 2009
- NEC ELECTRONICS CORPORATION
- Tooru Kumamoto
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
LEAD CUTTER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20090004827
- Publication date Jan 1, 2009
- NEC ELECTRONICS CORPORATION
- Tooru Kumamoto
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Lead cutter and method of fabricating semiconductor device
- Publication number 20070232027
- Publication date Oct 4, 2007
- NEC ELECTRONICS CORPORATION
- Tooru Kumamoto
- B26 - HAND CUTTING TOOLS CUTTING SEVERING

Tooru Kumamoto

Person

Patents Grantslast 30 patents

Lead forming apparatus and method of fabricating semiconductor device

Tilt inspection apparatus and method of inspecting tilt

Lead cutter and method of fabricating semiconductor device

Lead cutter and method of fabricating semiconductor device

Patents Applicationslast 30 patents

Die unit and method of manufacturing die unit

Cutting machine and method of measuring clearance

Tilt inspection apparatus and method of inspecting tilt

Lead cutter and method of cutting lead

LEAD FORMING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE

LEAD CUTTER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE

Lead cutter and method of fabricating semiconductor device