Torsten Huisinga

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded metal-insulator-metal capacitor
- Patent number 9,685,497
- Issue date Jun 20, 2017
- GLOBALFOUNDRIES Inc.
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an embedded metal-insulator-metal (MIM) capacitor
- Patent number 9,478,602
- Issue date Oct 25, 2016
- GLOBALFOUNDRIES Inc.
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for fabricating integrated circuits...
- Patent number 9,305,878
- Issue date Apr 5, 2016
- GLOBALFOUNDRIES, INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a protection layer to protect a metal hard mask...
- Patent number 9,287,109
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits including densifying in...
- Patent number 9,257,329
- Issue date Feb 9, 2016
- GLOBALFOUNDRIES, INC.
- Oliver Mieth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for fabricating integrated circuits...
- Patent number 8,932,911
- Issue date Jan 13, 2015
- GLOBALFOUNDRIES, INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising metallization layers of reduced int...
- Patent number 8,922,023
- Issue date Dec 30, 2014
- GLOBALFOUNDRIES Inc.
- Jens Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive structures using a dual metal hard ma...
- Patent number 8,859,418
- Issue date Oct 14, 2014
- GLOBALFOUNDRIES Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including ultra low-K (ULK) metallization stac...
- Patent number 8,786,088
- Issue date Jul 22, 2014
- GLOBALFOUNDRIES Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive structures in dielectric layers on an...
- Patent number 8,673,770
- Issue date Mar 18, 2014
- GLOBALFOUNDRIES Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising through hole vias having a stress r...
- Patent number 8,598,714
- Issue date Dec 3, 2013
- GLOBALFOUNDRIES Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective shrinkage of contact elements in a semiconductor device
- Patent number 8,536,050
- Issue date Sep 17, 2013
- GLOBALFOUNDRIES Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid contact structure with low aspect ratio contacts in a semico...
- Patent number 8,492,269
- Issue date Jul 23, 2013
- GLOBALFOUNDRIES Inc.
- Jens Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement of ultraviolet curing of tensile stress liner using ref...
- Patent number 8,435,841
- Issue date May 7, 2013
- GLOBALFOUNDRIES, INC.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sophisticated metallization systems in semiconductors formed by rem...
- Patent number 8,399,335
- Issue date Mar 19, 2013
- GLOBALFOUNDRIES, INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising metallization layers of reduced int...
- Patent number 8,383,510
- Issue date Feb 26, 2013
- GLOBALFOUNDRIES Inc.
- Jens Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing robustness of a dual stress liner approach in a semicond...
- Patent number 8,324,108
- Issue date Dec 4, 2012
- GLOBALFOUNDRIES Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating semiconductor devices having local contacts
- Patent number 8,216,928
- Issue date Jul 10, 2012
- GLOBALFOUNDRIES, INC.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metal silicide having a lower potential for co...
- Patent number 7,985,668
- Issue date Jul 26, 2011
- GLOBALFOUNDRIES Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED METAL-INSULATOR-METAL CAPACITOR
- Publication number 20170005159
- Publication date Jan 5, 2017
- GLOBALFOUNDRIES INC.
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL-INSULATOR-METAL CAPACITOR
- Publication number 20160099302
- Publication date Apr 7, 2016
- GLOBALFOUNDRIES INC.
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS
- Publication number 20150235896
- Publication date Aug 20, 2015
- GLOBALFOUNDRIES, Inc.
- Oliver Mieth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...
- Publication number 20150097291
- Publication date Apr 9, 2015
- GLOBALFOUNDRIES, Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH STRAINED SILICON AND METHODS FOR FABRICATI...
- Publication number 20150076559
- Publication date Mar 19, 2015
- GLOBALFOUNDRIES, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD INCLUDING A REMOVAL OF A HARDMASK FROM A SEMICONDUCTOR STRUC...
- Publication number 20140349479
- Publication date Nov 27, 2014
- Oliver Mieth
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING CONTACT STRUCTURES WITH PROTECTION...
- Publication number 20140264641
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A PROTECTION LAYER TO PROTECT A METAL HARD MASK...
- Publication number 20140264758
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...
- Publication number 20140239503
- Publication date Aug 28, 2014
- GLOBALFOUNDRIES, Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING METALLIZATION LAYERS OF REDUCED INT...
- Publication number 20140197544
- Publication date Jul 17, 2014
- GLOBALFOUNDRIES INC.
- Jens Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE ELECTRODE FILL AT REDUCED TEMPERATURES
- Publication number 20130302974
- Publication date Nov 14, 2013
- GLOBALFOUNDRIES INC.
- Jens Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LINE EDGE ROUGHNESS IN HARDMASK INTEGRATION SCHEMES
- Publication number 20130302989
- Publication date Nov 14, 2013
- GLOBALFOUNDRIES INC.
- Oisin Kenny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING INTEGRATED CIRCUITS WITH THE ELIMINATION OF...
- Publication number 20130189822
- Publication date Jul 25, 2013
- GLOBALFOUNDRIES INC.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Conductive Structures Using a Dual Metal Hard Ma...
- Publication number 20130178057
- Publication date Jul 11, 2013
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Filling Voids in Copper Structures
- Publication number 20130108779
- Publication date May 2, 2013
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods of Forming Conductive Structures in Dielectric Layers on an...
- Publication number 20130102147
- Publication date Apr 25, 2013
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAVIOLET (UV)-REFLECTING FILM FOR BEOL PROCESSING
- Publication number 20120235304
- Publication date Sep 20, 2012
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising Metallization Layers of Reduced Int...
- Publication number 20120223437
- Publication date Sep 6, 2012
- GLOBALFOUNDRIES INC.
- Jens Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING INTERCONNECT STRUCTURES AND METHODS FOR...
- Publication number 20120199980
- Publication date Aug 9, 2012
- GLOBALFOUNDRIES INC.
- Egon R. PFUETZNER
Information Patent Application
METHODS FOR FABRICATING SEMICONDUCTOR DEVICES HAVING LOCAL CONTACTS
- Publication number 20120190195
- Publication date Jul 26, 2012
- GLOBALFOUNDRIES INC.
- Ralf RICHTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CONTACT STRUCTURE WITH LOW ASPECT RATIO CONTACTS IN A SEMICO...
- Publication number 20120181692
- Publication date Jul 19, 2012
- GLOBALFOUNDRIES Inc.
- Jens Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCEMENT OF ULTRAVIOLET CURING OF TENSILE STRESS LINER USING REF...
- Publication number 20120161242
- Publication date Jun 28, 2012
- GLOBALFOUNDRIES INC.
- Ralf RICHTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Contact Structure with Reduced Pa...
- Publication number 20120153405
- Publication date Jun 21, 2012
- GLOBALFOUNDRIES INC.
- Jens Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increasing Robustness of a Dual Stress Liner Approach in a Semicond...
- Publication number 20120028470
- Publication date Feb 2, 2012
- GLOBALFOUNDRIES INC.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Ultra Low-K (ULK) Metallization Stac...
- Publication number 20120001323
- Publication date Jan 5, 2012
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sophisticated Metallization Systems in Semiconductors Formed by Rem...
- Publication number 20120001343
- Publication date Jan 5, 2012
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising Through Hole Vias Having a Stress R...
- Publication number 20120001330
- Publication date Jan 5, 2012
- GLOBALFOUNDRIES INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Shrinkage of Contact Elements in a Semiconductor Device
- Publication number 20110291292
- Publication date Dec 1, 2011
- GLOBALFOUNDRIES INC.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS

Torsten Huisinga

Person

Patents Grantslast 30 patents

Embedded metal-insulator-metal capacitor

Method of forming an embedded metal-insulator-metal (MIM) capacitor

Integrated circuits and methods for fabricating integrated circuits...

Methods of forming a protection layer to protect a metal hard mask...

Methods for fabricating integrated circuits including densifying in...

Integrated circuits and methods for fabricating integrated circuits...

Semiconductor device comprising metallization layers of reduced int...

Methods of forming conductive structures using a dual metal hard ma...

Semiconductor device including ultra low-K (ULK) metallization stac...

Methods of forming conductive structures in dielectric layers on an...

Semiconductor device comprising through hole vias having a stress r...

Selective shrinkage of contact elements in a semiconductor device

Hybrid contact structure with low aspect ratio contacts in a semico...

Enhancement of ultraviolet curing of tensile stress liner using ref...

Sophisticated metallization systems in semiconductors formed by rem...

Semiconductor device comprising metallization layers of reduced int...

Increasing robustness of a dual stress liner approach in a semicond...

Methods for fabricating semiconductor devices having local contacts

Method for forming a metal silicide having a lower potential for co...

Patents Applicationslast 30 patents

EMBEDDED METAL-INSULATOR-METAL CAPACITOR

EMBEDDED METAL-INSULATOR-METAL CAPACITOR

METHODS FOR FABRICATING INTEGRATED CIRCUITS

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...

INTEGRATED CIRCUITS WITH STRAINED SILICON AND METHODS FOR FABRICATI...

METHOD INCLUDING A REMOVAL OF A HARDMASK FROM A SEMICONDUCTOR STRUC...

SEMICONDUCTOR DEVICE COMPRISING CONTACT STRUCTURES WITH PROTECTION...

METHODS OF FORMING A PROTECTION LAYER TO PROTECT A METAL HARD MASK...

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...

SEMICONDUCTOR DEVICE COMPRISING METALLIZATION LAYERS OF REDUCED INT...

REPLACEMENT GATE ELECTRODE FILL AT REDUCED TEMPERATURES

REDUCING LINE EDGE ROUGHNESS IN HARDMASK INTEGRATION SCHEMES

METHODS OF FABRICATING INTEGRATED CIRCUITS WITH THE ELIMINATION OF...

Methods of Forming Conductive Structures Using a Dual Metal Hard Ma...

Methods of Filling Voids in Copper Structures

Methods of Forming Conductive Structures in Dielectric Layers on an...

ULTRAVIOLET (UV)-REFLECTING FILM FOR BEOL PROCESSING

Semiconductor Device Comprising Metallization Layers of Reduced Int...

INTEGRATED CIRCUITS HAVING INTERCONNECT STRUCTURES AND METHODS FOR...

METHODS FOR FABRICATING SEMICONDUCTOR DEVICES HAVING LOCAL CONTACTS

HYBRID CONTACT STRUCTURE WITH LOW ASPECT RATIO CONTACTS IN A SEMICO...

ENHANCEMENT OF ULTRAVIOLET CURING OF TENSILE STRESS LINER USING REF...

Semiconductor Device Comprising a Contact Structure with Reduced Pa...

Increasing Robustness of a Dual Stress Liner Approach in a Semicond...

Semiconductor Device Including Ultra Low-K (ULK) Metallization Stac...

Sophisticated Metallization Systems in Semiconductors Formed by Rem...

Semiconductor Device Comprising Through Hole Vias Having a Stress R...

Selective Shrinkage of Contact Elements in a Semiconductor Device