Toru Ishizuka

Person

Takasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing bonded SOI wafer
- Patent number 11,056,381
- Issue date Jul 6, 2021
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for manufacturing a bonded SOI wafer
- Patent number 10,424,484
- Issue date Sep 24, 2019
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 9,842,763
- Issue date Dec 12, 2017
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating SOI wafer by ion implantation
- Patent number 9,735,045
- Issue date Aug 15, 2017
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 9,673,085
- Issue date Jun 6, 2017
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reclaiming processing method for delaminated wafer
- Patent number 9,496,130
- Issue date Nov 15, 2016
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 9,378,999
- Issue date Jun 28, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 9,337,080
- Issue date May 10, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded SOI wafer
- Patent number 9,093,497
- Issue date Jul 28, 2015
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a bonded SOI wafer
- Patent number 9,076,840
- Issue date Jul 7, 2015
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 9,029,240
- Issue date May 12, 2015
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing direct bonded wafer and direct bonded wafer
- Patent number 7,521,334
- Issue date Apr 21, 2009
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDED WAFER PRODUCTION METHOD AND BONDED WAFER
- Publication number 20180277422
- Publication date Sep 27, 2018
- Shin-Etsu Handotai Co., Ltd.
- Toru ISHIZUKA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING BONDED SOI WAFER
- Publication number 20180247860
- Publication date Aug 30, 2018
- Shin-Etsu Handotai Co., Ltd.
- Toru ISHIZUKA
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER
- Publication number 20170345663
- Publication date Nov 30, 2017
- Shin-Etsu Handotai Co., Ltd.
- Toru ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20170301582
- Publication date Oct 19, 2017
- Shin-Etsu Handotai Co., Ltd.
- Toru ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING BONDED WAFER
- Publication number 20160079114
- Publication date Mar 17, 2016
- SHIN-ETSU HAN-DOTAI CO., LTD.
- Toru ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20150249035
- Publication date Sep 3, 2015
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20150243550
- Publication date Aug 27, 2015
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20150206790
- Publication date Jul 23, 2015
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20150064875
- Publication date Mar 5, 2015
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED SOI WAFER
- Publication number 20150017783
- Publication date Jan 15, 2015
- SHINE-ETSU HANDOTAI CO., LTD.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER
- Publication number 20140322895
- Publication date Oct 30, 2014
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECLAIMING PROCESSING METHOD FOR DELAMINATED WAFER
- Publication number 20140273400
- Publication date Sep 18, 2014
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Direct Bonded Wafer and Direct Bonded Wafer
- Publication number 20080102603
- Publication date May 1, 2008
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Toru Ishizuka

Person

Patents Grantslast 30 patents

Method for producing bonded SOI wafer

Method for manufacturing a bonded SOI wafer

Method for manufacturing bonded wafer

Method of fabricating SOI wafer by ion implantation

Method for manufacturing SOI wafer

Reclaiming processing method for delaminated wafer

Method for manufacturing SOI wafer

Method for manufacturing SOI wafer

Method for manufacturing bonded SOI wafer

Method for manufacturing a bonded SOI wafer

Method for manufacturing SOI wafer

Method for producing direct bonded wafer and direct bonded wafer

Patents Applicationslast 30 patents

BONDED WAFER PRODUCTION METHOD AND BONDED WAFER

METHOD FOR PRODUCING BONDED SOI WAFER

METHOD FOR MANUFACTURING A BONDED SOI WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD OF MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING BONDED SOI WAFER

METHOD FOR MANUFACTURING A BONDED SOI WAFER

RECLAIMING PROCESSING METHOD FOR DELAMINATED WAFER

Method for Producing Direct Bonded Wafer and Direct Bonded Wafer