Toru Mizuno

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for mounting photoelectric element
- Patent number 10,162,137
- Issue date Dec 25, 2018
- Nippon Mektron, Ltd.
- Toru Mizuno
- G02 - OPTICS
Information Patent Grant
Magnetic head device having suspension and spacer
- Patent number 9,514,772
- Issue date Dec 6, 2016
- TDK Corporation
- Takashi Kawashima
- G11 - INFORMATION STORAGE
Information Patent Grant
Workpiece mounting apparatus
- Patent number 9,374,936
- Issue date Jun 21, 2016
- TDK Corporation
- Toru Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application head and droplet applying apparatus
- Patent number 9,283,588
- Issue date Mar 15, 2016
- TDK Corporation
- Toru Mizuno
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Workpiece transfer apparatus
- Patent number 8,782,879
- Issue date Jul 22, 2014
- TDK Corporation
- Toru Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip component carrying method and system, and visual inspection me...
- Patent number 8,499,924
- Issue date Aug 6, 2013
- TDK Corporation
- Masayoshi Kobayashi
- G01 - MEASURING TESTING
Information Patent Grant
Chip component carrying method and system, and visual inspection me...
- Patent number 7,987,968
- Issue date Aug 2, 2011
- TDK Corporation
- Masayoshi Kobayashi
- G01 - MEASURING TESTING
Information Patent Grant
Ultrasonic mounting apparatus
- Patent number 7,828,190
- Issue date Nov 9, 2010
- TDK Corporation
- Yuji Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus mounting surface-mounted device on receiving dev...
- Patent number 7,814,645
- Issue date Oct 19, 2010
- TDK Corporation
- Toru Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for supplying electrically conductive material
- Patent number 7,810,705
- Issue date Oct 12, 2010
- TDK Corporation
- Toru Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for adjusting static attitude of thin film magnetic head
- Patent number 7,661,189
- Issue date Feb 16, 2010
- TDK Corporation
- Osamu Shindo
- G11 - INFORMATION STORAGE
Information Patent Grant
Conductive ball bonding method and conductive ball bonding apparatus
- Patent number 7,649,152
- Issue date Jan 19, 2010
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method, soldering device, bonding method, bonding device,...
- Patent number 7,591,406
- Issue date Sep 22, 2009
- TDK Corporation
- Tatsuya Wagoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Horn, horn unit, and bonding apparatus using same
- Patent number 7,508,115
- Issue date Mar 24, 2009
- TDK Corporation
- Norihiko Kawada
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Solder ball supplying method and supplying device
- Patent number 7,357,295
- Issue date Apr 15, 2008
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder dispenser
- Patent number 7,348,515
- Issue date Mar 25, 2008
- TDK Corporation
- Tatsuya Wagou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bonding method and solder bonding device
- Patent number 7,276,673
- Issue date Oct 2, 2007
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting machine and controller for the mounting machine
- Patent number 7,206,671
- Issue date Apr 17, 2007
- TDK Corporation
- Toru Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting an electronic part
- Patent number 7,181,833
- Issue date Feb 27, 2007
- TDK Corporation
- Toru Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball bonding method and bonding device
- Patent number 7,164,097
- Issue date Jan 16, 2007
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic head, and device and method for manufacturing the same
- Patent number 7,128,255
- Issue date Oct 31, 2006
- TDK Corporation
- Toru Mizuno
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus for mounting an electronic part onto a circuit substrate
- Patent number 6,931,717
- Issue date Aug 23, 2005
- TDK Corporation
- Toru Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic head, and device and method for manufacturing the same
- Patent number 6,751,061
- Issue date Jun 15, 2004
- TDK Corporation
- Toru Mizuno
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic head, and device and method for manufacturing the same
- Patent number 6,600,630
- Issue date Jul 29, 2003
- TDK Corporation
- Toru Mizuno
- G11 - INFORMATION STORAGE
Information Patent Grant
Machine controller and process with two-step interpolation
- Patent number 6,539,275
- Issue date Mar 25, 2003
- Fanuc Ltd
- Toru Mizuno
- G05 - CONTROLLING REGULATING
Information Patent Grant
Chip junction nozzle
- Patent number 6,382,495
- Issue date May 7, 2002
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip junction nozzle
- Patent number 6,189,760
- Issue date Feb 20, 2001
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastener for an electronic component
- Patent number D359726
- Issue date Jun 27, 1995
- TDK Corporation
- Tatuo Umeya
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Fastener for electronic component
- Patent number 5,264,815
- Issue date Nov 23, 1993
- TDK Corporation
- Tatuo Umeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of starting arc sensing
- Patent number 4,906,814
- Issue date Mar 6, 1990
- Fanuc Ltd.
- Kenichi Toyoda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC HEAD DEVICE
- Publication number 20160275975
- Publication date Sep 22, 2016
- TDK Corporation
- Takashi KAWASHIMA
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS AND METHOD FOR MOUNTING PHOTOELECTRIC ELEMENT
- Publication number 20150153523
- Publication date Jun 4, 2015
- NIPPON MEKTRON, LTD.
- Toru Mizuno
- G02 - OPTICS
Information Patent Application
WORKPIECE MOUNTING APPARATUS
- Publication number 20140290047
- Publication date Oct 2, 2014
- Toru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION HEAD AND DROPLET APPLYING APPARATUS
- Publication number 20130277457
- Publication date Oct 24, 2013
- Toru Mizuno
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
WORKPIECE TRANSFER APPARATUS, WORKPIECE MOUNTING APPARATUS AND WORK...
- Publication number 20130055541
- Publication date Mar 7, 2013
- TDK Corporation
- Toru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPONENT CARRYING METHOD AND SYSTEM, AND VISUAL INSPECTION ME...
- Publication number 20110261185
- Publication date Oct 27, 2011
- TDK Corporation
- Masayoshi Kobayashi
- G01 - MEASURING TESTING
Information Patent Application
ULTRASONIC MOUNTING APPARATUS
- Publication number 20090255979
- Publication date Oct 15, 2009
- TDK Corporation
- Yuji Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS MOUNTING SURFACE-MOUNTED DEVICE ON RECEIVING DEV...
- Publication number 20090031558
- Publication date Feb 5, 2009
- TDK Corporation
- Toru MIZUNO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD AND BONDING APPARATUS
- Publication number 20090001054
- Publication date Jan 1, 2009
- TDK Corporation
- Toru Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR SUPPLYING ELECTRICALLY CONDUCTIVE MATERIAL
- Publication number 20080073413
- Publication date Mar 27, 2008
- TDK Corporation
- Toru Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE MEMBER SUPPLY APPARATUS AND CONDUCTIVE MEMBER SUPPLY METHOD
- Publication number 20080050209
- Publication date Feb 28, 2008
- TDK Corporation
- Toru Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADJOINING APPARATUS AND NOZZLE UNIT THEREFOR
- Publication number 20070228021
- Publication date Oct 4, 2007
- TDK Corporation
- Tatsuya Wagou
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip Component Carrying Method and System, and Visual Inspection Me...
- Publication number 20070205084
- Publication date Sep 6, 2007
- TDK Corporation
- Masayoshi Kobayashi
- G01 - MEASURING TESTING
Information Patent Application
Horn, horn unit, and bonding apparatus using same
- Publication number 20070144680
- Publication date Jun 28, 2007
- TDK Corporation
- Norihiko Kawada
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Method and apparatus for adjusting static attitude of magnetic head
- Publication number 20070075061
- Publication date Apr 5, 2007
- TDK Corporation
- Osamu Shindo
- G11 - INFORMATION STORAGE
Information Patent Application
Method and apparatus for adjusting static attitude of thin film mag...
- Publication number 20070064333
- Publication date Mar 22, 2007
- TDK Corporation
- Osamu Shindo
- G11 - INFORMATION STORAGE
Information Patent Application
SOLDER DISPENSER
- Publication number 20060237514
- Publication date Oct 26, 2006
- TDK Corporation
- Tatsuya WAGOU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING METHOD, SOLDERING DEVICE, BONDING METHOD, BONDING DEVICE,...
- Publication number 20060219760
- Publication date Oct 5, 2006
- TDK Corporation
- Tatsuya Wagoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive ball bonding method and conductive ball bonding apparatus
- Publication number 20060065641
- Publication date Mar 30, 2006
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for cleaning mounting nozzle, and mounting mac...
- Publication number 20050272351
- Publication date Dec 8, 2005
- TDK Corporation
- Toru Mizuno
- B08 - CLEANING
Information Patent Application
Mounting machine and controller for the mounting machine
- Publication number 20050241143
- Publication date Nov 3, 2005
- Toru Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for mounting electronic part
- Publication number 20050076497
- Publication date Apr 14, 2005
- TDK Corporation
- Toru Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for mounting electronic part
- Publication number 20050076498
- Publication date Apr 14, 2005
- TDK Corporation
- Toru Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder bonding method and solder bonding device
- Publication number 20050067395
- Publication date Mar 31, 2005
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball bonding method and bonding device
- Publication number 20050051521
- Publication date Mar 10, 2005
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball supplying method and supplying device
- Publication number 20050045701
- Publication date Mar 3, 2005
- TDK Corporation
- Osamu Shindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Magnetic head, and device and method for manufacturing the same
- Publication number 20030193741
- Publication date Oct 16, 2003
- TDK Corp.
- Toru Mizuno
- G11 - INFORMATION STORAGE
Information Patent Application
Magnetic head, and device and method for manufacturing the same
- Publication number 20030189793
- Publication date Oct 9, 2003
- TDK Corporation
- Toru Mizuno
- G11 - INFORMATION STORAGE
Information Patent Application
Magnetic head, and device and method for manufacturing the same
- Publication number 20010026421
- Publication date Oct 4, 2001
- TDK CORPORATION
- Toru Mizuno
- G11 - INFORMATION STORAGE
Information Patent Application
Chip junction nozzle
- Publication number 20010011668
- Publication date Aug 9, 2001
- TDK CORPORATION 13-1, Nihonbashi 1-chome, Chuo-ku, Tokyo, Japan
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS

Toru Mizuno

Person

Patents Grantslast 30 patents

Apparatus and method for mounting photoelectric element

Magnetic head device having suspension and spacer

Workpiece mounting apparatus

Application head and droplet applying apparatus

Workpiece transfer apparatus

Chip component carrying method and system, and visual inspection me...

Chip component carrying method and system, and visual inspection me...

Ultrasonic mounting apparatus

Mounting apparatus mounting surface-mounted device on receiving dev...

Apparatus and method for supplying electrically conductive material

Apparatus for adjusting static attitude of thin film magnetic head

Conductive ball bonding method and conductive ball bonding apparatus

Soldering method, soldering device, bonding method, bonding device,...

Horn, horn unit, and bonding apparatus using same

Solder ball supplying method and supplying device

Solder dispenser

Solder bonding method and solder bonding device

Mounting machine and controller for the mounting machine

Method of mounting an electronic part

Solder ball bonding method and bonding device

Magnetic head, and device and method for manufacturing the same

Apparatus for mounting an electronic part onto a circuit substrate

Magnetic head, and device and method for manufacturing the same

Magnetic head, and device and method for manufacturing the same

Machine controller and process with two-step interpolation

Chip junction nozzle

Chip junction nozzle

Fastener for an electronic component

Fastener for electronic component

Method of starting arc sensing

Patents Applicationslast 30 patents

MAGNETIC HEAD DEVICE

APPARATUS AND METHOD FOR MOUNTING PHOTOELECTRIC ELEMENT

WORKPIECE MOUNTING APPARATUS

APPLICATION HEAD AND DROPLET APPLYING APPARATUS

WORKPIECE TRANSFER APPARATUS, WORKPIECE MOUNTING APPARATUS AND WORK...

CHIP COMPONENT CARRYING METHOD AND SYSTEM, AND VISUAL INSPECTION ME...

ULTRASONIC MOUNTING APPARATUS

MOUNTING APPARATUS MOUNTING SURFACE-MOUNTED DEVICE ON RECEIVING DEV...

BONDING METHOD AND BONDING APPARATUS

APPARATUS AND METHOD FOR SUPPLYING ELECTRICALLY CONDUCTIVE MATERIAL

CONDUCTIVE MEMBER SUPPLY APPARATUS AND CONDUCTIVE MEMBER SUPPLY METHOD

ADJOINING APPARATUS AND NOZZLE UNIT THEREFOR

Chip Component Carrying Method and System, and Visual Inspection Me...

Horn, horn unit, and bonding apparatus using same

Method and apparatus for adjusting static attitude of magnetic head

Method and apparatus for adjusting static attitude of thin film mag...

SOLDER DISPENSER

SOLDERING METHOD, SOLDERING DEVICE, BONDING METHOD, BONDING DEVICE,...

Conductive ball bonding method and conductive ball bonding apparatus

Method and apparatus for cleaning mounting nozzle, and mounting mac...

Mounting machine and controller for the mounting machine

Apparatus and method for mounting electronic part

Apparatus and method for mounting electronic part

Solder bonding method and solder bonding device

Solder ball bonding method and bonding device

Solder ball supplying method and supplying device

Magnetic head, and device and method for manufacturing the same

Magnetic head, and device and method for manufacturing the same

Magnetic head, and device and method for manufacturing the same

Chip junction nozzle