Toru OKADA

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate on which electronic component is soldered, electronic dev...
- Patent number 10,299,387
- Issue date May 21, 2019
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting electronic component
- Patent number 9,089,086
- Issue date Jul 21, 2015
- Fujitsu Limited
- Tohru Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of determining reinforcement position of circuit substrate a...
- Patent number 9,053,262
- Issue date Jun 9, 2015
- Fujitsu Limited
- Hiroshi Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board reinforcing structure, board assembly, and electronic device
- Patent number 8,604,347
- Issue date Dec 10, 2013
- Fujitsu Limited
- Hiroshi Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repair apparatus and repair method
- Patent number 8,434,670
- Issue date May 7, 2013
- Fujitsu Limited
- Toru Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact sensor unit, electronic device, and method for producing a...
- Patent number 8,183,873
- Issue date May 22, 2012
- Fujitsu Limited
- Hiroshi Kobayashi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of heating superposed components and heating apparatus therefor
- Patent number 8,153,941
- Issue date Apr 10, 2012
- Fujitsu Limited
- Masanao Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro component removing method
- Patent number 7,963,434
- Issue date Jun 21, 2011
- Fujitsu Limited
- Keiichi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module
- Patent number 7,824,111
- Issue date Nov 2, 2010
- Fujitsu Limited
- Toru Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro component removing apparatus
- Patent number 7,753,251
- Issue date Jul 13, 2010
- Fujitsu Limited
- Keiichi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder repairing apparatus and method of repairing solder
- Patent number 7,748,594
- Issue date Jul 6, 2010
- Fujitsu Limited
- Keiichi Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball capturing apparatus, solder ball disposing apparatus, ball cap...
- Patent number 7,717,317
- Issue date May 18, 2010
- Fujitsu Limited
- Masanao Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module producing method and apparatus
- Patent number 7,691,662
- Issue date Apr 6, 2010
- Fujitsu Limited
- Toru Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip element, semiconductor chip element mounting str...
- Patent number 7,436,062
- Issue date Oct 14, 2008
- Fujitsu Limited
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a micro-actuator
- Patent number 7,356,894
- Issue date Apr 15, 2008
- Fujitsu Limited
- Masanao Fujii
- G11 - INFORMATION STORAGE
Information Patent Grant
Head assembly, disk unit, and bonding method and apparatus
- Patent number 7,347,347
- Issue date Mar 25, 2008
- Fujitsu Limited
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Design support system
- Patent number 7,133,733
- Issue date Nov 7, 2006
- Fujitsu Limited
- Toru Okada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Parts mounting and assembling apparatus
- Patent number 7,111,390
- Issue date Sep 26, 2006
- Fujitsu Limited
- Koichi Shimamura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display
- Patent number 6,903,876
- Issue date Jun 7, 2005
- Fujitsu Limited
- Toru Okada
- G02 - OPTICS
Information Patent Grant
Head assembly having integrated circuit chip covered by layer which...
- Patent number 6,885,522
- Issue date Apr 26, 2005
- Fujitsu Limited
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of producing a micro-actuator
- Patent number 6,848,154
- Issue date Feb 1, 2005
- Fujitsu Limited
- Masanao Fujii
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of bonding piezoelectric element and electrode, and piezoele...
- Patent number 6,744,183
- Issue date Jun 1, 2004
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Micro-actuator and method of producing the same
- Patent number 6,653,761
- Issue date Nov 25, 2003
- Fujitsu Limited
- Masanao Fujii
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of bonding piezoelectric element and electrode, and piezoele...
- Patent number 6,541,898
- Issue date Apr 1, 2003
- Fujitsu Limited
- Masayuki Kitajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip element, semiconductor chip element mounting str...
- Patent number 6,483,190
- Issue date Nov 19, 2002
- Fujitsu Limited
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling micro-actuator
- Patent number 6,467,141
- Issue date Oct 22, 2002
- Fujitsu Limited
- Toru Okada
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit chip supporting and electrically connecting a he...
- Patent number 6,400,529
- Issue date Jun 4, 2002
- Fujitsu Limited
- Shunji Baba
- G11 - INFORMATION STORAGE
Information Patent Grant
Variable gain semiconductor circuit
- Patent number 5,859,556
- Issue date Jan 12, 1999
- Fujitsu Limited
- Toru Okada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Soldering apparatus
- Patent number 5,560,534
- Issue date Oct 1, 1996
- Fujitsu Limited
- Toru Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...
- Publication number 20180343748
- Publication date Nov 29, 2018
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING METHOD, SOLDERING APPARATUS, AND METHOD FOR MAINTAINING S...
- Publication number 20180221978
- Publication date Aug 9, 2018
- Fujitsu Limited
- Toru Okada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CIRCUIT BOARD DEVICE AND ELECTRONIC DEVICE
- Publication number 20140078700
- Publication date Mar 20, 2014
- Fujitsu Limited
- Takumi MASUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL COMPONENT MANUFACTURING METHOD AND OPTICAL COMPONENT MANUFA...
- Publication number 20140001660
- Publication date Jan 2, 2014
- Toru OKADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
HEAT TRANSFER CAP AND REPAIRING APPARATUS AND METHOD
- Publication number 20130322057
- Publication date Dec 5, 2013
- Fujitsu Limited
- Toru OKADA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20130256022
- Publication date Oct 3, 2013
- Fujitsu Limited
- Hiroshi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING REINFORCEMENT POSITION OF CIRCUIT SUBSTRATE A...
- Publication number 20130128477
- Publication date May 23, 2013
- Hiroshi KOBAYASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR HEATING ELECTRONIC COMPONENT
- Publication number 20120090195
- Publication date Apr 19, 2012
- Fujitsu Limited
- Mitsuo TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20120060356
- Publication date Mar 15, 2012
- Fujitsu Limited
- Tohru Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSE...
- Publication number 20110303450
- Publication date Dec 15, 2011
- Fujitsu Limited
- Toru OKADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD
- Publication number 20110303449
- Publication date Dec 15, 2011
- Fujitsu Limited
- Hiroshi KOBAYASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20110303441
- Publication date Dec 15, 2011
- Fujitsu Limited
- Hiroshi KOBAYASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND M...
- Publication number 20110303443
- Publication date Dec 15, 2011
- Fujitsu Limited
- Masayuki KITAJIMA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE
- Publication number 20110304059
- Publication date Dec 15, 2011
- Fujitsu Limited
- Hiroshi KOBAYASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
REPAIR APPARATUS AND METHOD FOR ELECTRONIC COMPONENT AND HEAT-TRANS...
- Publication number 20110240720
- Publication date Oct 6, 2011
- FUJITSU LIMITED
- Toru OKADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO COMPONENT REMOVING METHOD
- Publication number 20100213248
- Publication date Aug 26, 2010
- Fujitsu Limited
- Keiichi YAMAMOTO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONTACT SENSOR UNIT, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING A...
- Publication number 20100097080
- Publication date Apr 22, 2010
- Fujitsu Limited
- Hiroshi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REPAIR APPARATUS AND REPAIR METHOD
- Publication number 20090321500
- Publication date Dec 31, 2009
- FUJITSU LIMITED
- Toru OKADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder repairing apparatus and method of repairing solder
- Publication number 20090045245
- Publication date Feb 19, 2009
- FUJITSU LIMITED
- Keiichi Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING APPARATUS
- Publication number 20080296266
- Publication date Dec 4, 2008
- Fujitsu Limited
- Toru Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical module producing method and apparatus
- Publication number 20080102544
- Publication date May 1, 2008
- FUJITSU LIMITED
- Toru Okada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MICRO COMPONENT REMOVING METHOD AND MICRO COMPONENT REMOVING APPARATUS
- Publication number 20080099536
- Publication date May 1, 2008
- Fujitsu Limited
- Keiichi YAMAMOTO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
OPTICAL MODULE
- Publication number 20080101746
- Publication date May 1, 2008
- FUJITSU LIMITED
- Toru Okada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BALL CAPTURING APPARATUS, SOLDER BALL DISPOSING APPARATUS, BALL CAP...
- Publication number 20080020561
- Publication date Jan 24, 2008
- Fujitsu Limited
- Masanao FUJII
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering method and apparatus
- Publication number 20060169750
- Publication date Aug 3, 2006
- FUJITSU LIMITED
- Hisao Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micro-actuator and method of producing the same
- Publication number 20050104477
- Publication date May 19, 2005
- FUJITSU LIMITED
- Masanao Fujii
- G11 - INFORMATION STORAGE
Information Patent Application
Head assembly, disk unit, and bonding method and apparatus
- Publication number 20050057856
- Publication date Mar 17, 2005
- FUJITSU LIMITED
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Design support system
- Publication number 20050038537
- Publication date Feb 17, 2005
- FUJITSU LIMITED
- Toru Okada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Parts mounting and assembling apparatus
- Publication number 20050034960
- Publication date Feb 17, 2005
- FUJITSU LIMITED
- Koichi Shimamura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro-actuator and method of producing the same
- Publication number 20030184191
- Publication date Oct 2, 2003
- FUJITSU LIMITED
- Masanao Fujii
- G11 - INFORMATION STORAGE

Person

Patents Grantslast 30 patents

Substrate on which electronic component is soldered, electronic dev...

Apparatus for mounting electronic component

Method of determining reinforcement position of circuit substrate a...

Board reinforcing structure, board assembly, and electronic device

Repair apparatus and repair method

Contact sensor unit, electronic device, and method for producing a...

Method of heating superposed components and heating apparatus therefor

Micro component removing method

Optical module

Micro component removing apparatus

Solder repairing apparatus and method of repairing solder

Ball capturing apparatus, solder ball disposing apparatus, ball cap...

Optical module producing method and apparatus

Semiconductor chip element, semiconductor chip element mounting str...

Method of producing a micro-actuator

Head assembly, disk unit, and bonding method and apparatus

Design support system

Parts mounting and assembling apparatus

Display

Head assembly having integrated circuit chip covered by layer which...

Method of producing a micro-actuator

Method of bonding piezoelectric element and electrode, and piezoele...

Micro-actuator and method of producing the same

Method of bonding piezoelectric element and electrode, and piezoele...

Semiconductor chip element, semiconductor chip element mounting str...

Method of assembling micro-actuator

Integrated circuit chip supporting and electrically connecting a he...

Variable gain semiconductor circuit

Soldering apparatus

Patents Applicationslast 30 patents

SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...

SOLDERING METHOD, SOLDERING APPARATUS, AND METHOD FOR MAINTAINING S...

CIRCUIT BOARD DEVICE AND ELECTRONIC DEVICE

OPTICAL COMPONENT MANUFACTURING METHOD AND OPTICAL COMPONENT MANUFA...

HEAT TRANSFER CAP AND REPAIRING APPARATUS AND METHOD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

METHOD OF DETERMINING REINFORCEMENT POSITION OF CIRCUIT SUBSTRATE A...

APPARATUS AND METHOD FOR HEATING ELECTRONIC COMPONENT

APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSE...

PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD

BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE

MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND M...

CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND SEMICONDUCTOR DEVICE

REPAIR APPARATUS AND METHOD FOR ELECTRONIC COMPONENT AND HEAT-TRANS...

MICRO COMPONENT REMOVING METHOD

CONTACT SENSOR UNIT, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING A...

REPAIR APPARATUS AND REPAIR METHOD

Solder repairing apparatus and method of repairing solder

PROCESSING APPARATUS

Optical module producing method and apparatus

MICRO COMPONENT REMOVING METHOD AND MICRO COMPONENT REMOVING APPARATUS

OPTICAL MODULE

BALL CAPTURING APPARATUS, SOLDER BALL DISPOSING APPARATUS, BALL CAP...

Soldering method and apparatus

Micro-actuator and method of producing the same

Head assembly, disk unit, and bonding method and apparatus

Design support system

Parts mounting and assembling apparatus

Micro-actuator and method of producing the same