Toshifumi Matsushima

Person

Ageo-City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper-clad laminate
- Patent number 11,950,376
- Issue date Apr 2, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, metal foil provided with resin layer, metal clad...
- Patent number 11,419,210
- Issue date Aug 16, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, copper foil with resin, dielectric layer, copper...
- Patent number 11,310,910
- Issue date Apr 19, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-clad copper foil, copper-clad laminated plate, and printed wi...
- Patent number 11,166,383
- Issue date Nov 2, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal foil with releasing resin layer, and printed wiring board
- Patent number 10,863,621
- Issue date Dec 8, 2020
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper clad laminate for forming of embedded capacitor layer, multi...
- Patent number 10,524,360
- Issue date Dec 31, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- B32 - LAYERED PRODUCTS
Information Patent Grant
Production method for printed wiring board having dielectric layer
- Patent number 10,342,143
- Issue date Jul 2, 2019
- MITSUI MINNG & SMELTING CO., LTD.
- Toshiyuki Shimizu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper clad laminate provided with protective layer and multilayere...
- Patent number 10,244,640
- Issue date Mar 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper clad laminate for forming of embedded capacitor layer, multi...
- Patent number 9,924,597
- Issue date Mar 20, 2018
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with ultra thin adhesive layer, and a method for manufa...
- Patent number 8,815,387
- Issue date Aug 26, 2014
- Mitsu Minning & Smelting Co., Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition for forming insulating layer of printed wiring board
- Patent number 8,431,224
- Issue date Apr 30, 2013
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited copper foil with carrier foil with a primer resin...
- Patent number 8,304,091
- Issue date Nov 6, 2012
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN...
- Patent number 6,905,757
- Issue date Jun 14, 2005
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-coated copper foil, and printed wiring board using resin-coat...
- Patent number 6,831,129
- Issue date Dec 14, 2004
- Mitsui Mining & Smelting Co. Ltd.
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Double-sided copper clad laminate for capacitor layer formation and...
- Patent number 6,693,793
- Issue date Feb 17, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER-CLAD LAMINATE
- Publication number 20210029823
- Publication date Jan 28, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Toshihiro HOSOI
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...
- Publication number 20200362169
- Publication date Nov 19, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...
- Publication number 20200008298
- Publication date Jan 2, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRODUCTION METHOD FOR PRINTED WIRING BOARD HAVING DIELECTRIC LAYER
- Publication number 20180332721
- Publication date Nov 15, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Toshiyuki SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN-CLAD COPPER FOIL, COPPER-CLAD LAMINATED PLATE, AND PRINTED WI...
- Publication number 20180206345
- Publication date Jul 19, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...
- Publication number 20180160536
- Publication date Jun 7, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Fujio KUWAKO
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL FOIL WITH RELEASING RESIN LAYER, AND PRINTED WIRING BOARD
- Publication number 20170071059
- Publication date Mar 9, 2017
- Mitsui Mining and Smelting Co., Ltd.
- Toshifumi MATSUSHIMA
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER CLAD LAMINATE PROVIDED WITH PROTECTIVE LAYER AND MULTILAYERE...
- Publication number 20160360624
- Publication date Dec 8, 2016
- Mitsui Mining and Smelting Co., Ltd.
- Fujio KUWAKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...
- Publication number 20160330839
- Publication date Nov 10, 2016
- Mitsui Mining and Smelting Co., Ltd.
- Fujio KUWAKO
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, METAL FOIL PROVIDED WITH RESIN LAYER, METAL CLAD...
- Publication number 20150140296
- Publication date May 21, 2015
- Mitsui Mining and Smelting Co., Ltd.
- Toshifumi Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR FORMING INSULATING LAYER OF PRINTED WIRING BOARD
- Publication number 20100108368
- Publication date May 6, 2010
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SURFACE-TREATED COPPER FOIL, SURFACE-TREATED COPPER FOIL WITH VERY...
- Publication number 20100068511
- Publication date Mar 18, 2010
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposited Copper Foil with Carrier Foil with a Primer Resin...
- Publication number 20080107865
- Publication date May 8, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Resin containing dielectric filler for formation of built-in capact...
- Publication number 20040147658
- Publication date Jul 29, 2004
- Toshifumi Matsushima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin-coated copper foil, and printed wiring board using resin-coat...
- Publication number 20030087101
- Publication date May 8, 2003
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Double-sided copper clad laminate for capacitor layer formation and...
- Publication number 20030072129
- Publication date Apr 17, 2003
- Fujio Kuwako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Toshifumi Matsushima

Person

Patents Grantslast 30 patents

Copper-clad laminate

Resin composition, metal foil provided with resin layer, metal clad...

Resin composition, copper foil with resin, dielectric layer, copper...

Resin-clad copper foil, copper-clad laminated plate, and printed wi...

Metal foil with releasing resin layer, and printed wiring board

Copper clad laminate for forming of embedded capacitor layer, multi...

Production method for printed wiring board having dielectric layer

Copper clad laminate provided with protective layer and multilayere...

Copper clad laminate for forming of embedded capacitor layer, multi...

Copper foil with ultra thin adhesive layer, and a method for manufa...

Resin composition for forming insulating layer of printed wiring board

Electrodeposited copper foil with carrier foil with a primer resin...

DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN...

Resin-coated copper foil, and printed wiring board using resin-coat...

Double-sided copper clad laminate for capacitor layer formation and...

Patents Applicationslast 30 patents

COPPER-CLAD LAMINATE

RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...

RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...

PRODUCTION METHOD FOR PRINTED WIRING BOARD HAVING DIELECTRIC LAYER

RESIN-CLAD COPPER FOIL, COPPER-CLAD LAMINATED PLATE, AND PRINTED WI...

COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...

METAL FOIL WITH RELEASING RESIN LAYER, AND PRINTED WIRING BOARD

COPPER CLAD LAMINATE PROVIDED WITH PROTECTIVE LAYER AND MULTILAYERE...

COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...

RESIN COMPOSITION, METAL FOIL PROVIDED WITH RESIN LAYER, METAL CLAD...

RESIN COMPOSITION FOR FORMING INSULATING LAYER OF PRINTED WIRING BOARD

SURFACE-TREATED COPPER FOIL, SURFACE-TREATED COPPER FOIL WITH VERY...

Electrodeposited Copper Foil with Carrier Foil with a Primer Resin...

Resin containing dielectric filler for formation of built-in capact...

Resin-coated copper foil, and printed wiring board using resin-coat...

Double-sided copper clad laminate for capacitor layer formation and...