TREA

Toshiharu Daii

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Back grinding method for wafer
    • Patent number 8,025,553
    • Issue date Sep 27, 2011
    • Disco Corporation
    • Kazuma Sekiya
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Method of machining substrate
    • Patent number 7,682,224
    • Issue date Mar 23, 2010
    • Disco Corporation
    • Yusuke Kimura
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

  • Information Patent Application

    CUTTING METHOD FOR DEVICE WAFER
    • Publication number 20130203237
    • Publication date Aug 8, 2013
    • Disco Corporation
    • Akira YAMAGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20110097875
    • Publication date Apr 28, 2011
    • Disco Corporation
    • Yohei Gokita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BACK GRINDING METHOD FOR WAFER
    • Publication number 20090042488
    • Publication date Feb 12, 2009
    • Disco Corporation
    • Kazuma Sekiya
    • B24 - GRINDING POLISHING
  • Information Patent Application

    METHOD OF MACHINING SUBSTRATE
    • Publication number 20080318497
    • Publication date Dec 25, 2008
    • Disco Corporation
    • Yusuke Kimura
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Semiconductor wafer processing method
    • Publication number 20040161940
    • Publication date Aug 19, 2004
    • Toshiharu Daii
    • H01 - BASIC ELECTRIC ELEMENTS