TREA

Toshiharu Sakurai

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  • Yokohama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device having an improved lead arrangement and method...
    • Patent number 5,198,883
    • Issue date Mar 30, 1993
    • Kabushiki Kaisha Toshiba
    • Kenji Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cover plate for semiconductor devices
    • Patent number 5,096,081
    • Issue date Mar 17, 1992
    • Kabushiki Kaisha Toshiba
    • Masamichi Shindo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of sealing semiconductor device with resin by pressing a lea...
    • Patent number 5,091,341
    • Issue date Feb 25, 1992
    • Kabushiki Kaisha Toshiba
    • Junichi Asada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 5,025,347
    • Issue date Jun 18, 1991
    • Kabushiki Kaisha Toshiba
    • Masamichi Shindo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lead frame
    • Patent number 4,910,577
    • Issue date Mar 20, 1990
    • Kabushiki Kaisha Toshiba
    • Atsushi Sonoda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 4,855,807
    • Issue date Aug 8, 1989
    • Kabushiki Kaisha Toshiba
    • Yasuhiro Yamaji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device of resin-seal type
    • Patent number 4,654,692
    • Issue date Mar 31, 1987
    • Kabushiki Kaisha Toshiba
    • Toshiharu Sakurai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fe-Ni-Cu leadframe
    • Patent number 4,604,642
    • Issue date Aug 5, 1986
    • Kabushiki Kaisha Toshiba
    • Toshiharu Sakurai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic parts
    • Patent number 4,482,611
    • Issue date Nov 13, 1984
    • Tokyo Shibaura Denki Kabushiki Kaisha
    • Koichi Teshima
    • H01 - BASIC ELECTRIC ELEMENTS