Claims
- 1. In a resin-seal type semiconductor device having a wiring part of a semiconductor surface sealed with a resin, the improvement which comprises at least one slit formed in the wiring part for absorbing stress imparted thereto, each of said slits being arranged to be substantially parallel to a peripheral side of the device which is most closely located to the wiring part.
- 2. A resin-seal type semiconductor device according to claim 1 in which a plurality of slits are formed in the wiring part in a mutually parallel and spacedapart state.
- 3. A resin-seal type semiconductor device according to claim 1 in which said at least one slit is formed by providing one or more separated slits in the wiring part in the longitudinal direction thereof.
- 4. A resin-seal type semiconductor device according to claim 1 in which the wiring part is an aluminum wiring layer.
- 5. A resin-seal type semiconductor device comprising:
- a semiconductor having resin-sealed surface;
- a wiring layer disposed above said surface;
- a means, formed integrally with said wiring layer and defining at least one slit, for absorbing stress forces imparted thereto and thereby preventing the formation of cracks in said device;
- wherein said means defines at least one slit oriented to be substantially parallel to a peripheral side of the device which is most closely located to the wiring part.
Priority Claims (1)
Number |
Date |
Country |
Kind |
58-118519 |
Jun 1983 |
JPX |
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Parent Case Info
This application is a continuation of application Ser. No. 625,541, filed June 28, 1984, now abandoned.
US Referenced Citations (3)
Foreign Referenced Citations (2)
Number |
Date |
Country |
3115406 |
Jun 1982 |
DEX |
2088629 |
Oct 1981 |
GBX |
Continuations (1)
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Number |
Date |
Country |
Parent |
625541 |
Jun 1984 |
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