Toshihiko AKIBA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,148,680
- Issue date Nov 19, 2024
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,566,255
- Issue date Feb 18, 2020
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,791
- Issue date Dec 25, 2018
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 10,134,648
- Issue date Nov 20, 2018
- Renesas Electronics Corporation
- Toshihiko Akiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,128,129
- Issue date Nov 13, 2018
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bond pad wiring lead-out arrangement avoi...
- Patent number 9,911,673
- Issue date Mar 6, 2018
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,711,377
- Issue date Jul 18, 2017
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bond pad wiring lead-out arrangement avoi...
- Patent number 9,646,901
- Issue date May 9, 2017
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire to bonding pad
- Patent number 9,293,436
- Issue date Mar 22, 2016
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,165,845
- Issue date Oct 20, 2015
- Renesas Electronics Corporation
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 8,912,540
- Issue date Dec 16, 2014
- Renesas Electronics Corporations
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,791,574
- Issue date Jul 29, 2014
- Renesas Electronics Corporation
- Toshihiko Akiba
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,415,199
- Issue date Apr 9, 2013
- Renesas Electronics Corporation
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,298,963
- Issue date Oct 30, 2012
- Renesas Electronics Corporation
- Toshihiko Akiba
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,101,433
- Issue date Jan 24, 2012
- Renesas Electronics Corporation
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,847,413
- Issue date Dec 7, 2010
- Renesas Electronics Corporation
- Toshihiko Akiba
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220165638
- Publication date May 26, 2022
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190348332
- Publication date Nov 14, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20190057913
- Publication date Feb 21, 2019
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180294239
- Publication date Oct 11, 2018
- RENESAS ELECTRONICS CORPORATION
- Kenji SAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180158771
- Publication date Jun 7, 2018
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20180145001
- Publication date May 24, 2018
- RENESAS ELECTRONICS CORPORATION
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170278722
- Publication date Sep 28, 2017
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BOND PAD WIRING LEAD-OUT ARRANGEMENT AVOI...
- Publication number 20170229359
- Publication date Aug 10, 2017
- RENESAS ELECTRONICS CORPORATION
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160336244
- Publication date Nov 17, 2016
- RENESAS ELECTRONICS CORPORATION
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20160197050
- Publication date Jul 7, 2016
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device
- Publication number 20160133484
- Publication date May 12, 2016
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method of Semiconductor Device
- Publication number 20160035636
- Publication date Feb 4, 2016
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20150333030
- Publication date Nov 19, 2015
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361299
- Publication date Dec 11, 2014
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130193438
- Publication date Aug 1, 2013
- RENESAS ELECTRONICS CORPORATION
- Toshihiko Akiba
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20130062747
- Publication date Mar 14, 2013
- Renesas Electronics Corporation
- TOSHIHIKO AKIBA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Manufacturing Method of Semiconductor Device
- Publication number 20120077310
- Publication date Mar 29, 2012
- Renesas Electronics Corporation
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20100301459
- Publication date Dec 2, 2010
- RENESAS TECHNOLOGY CORP.
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20100181681
- Publication date Jul 22, 2010
- RENESAS TECHNOLOGY CORP.
- Toshihiko AKIBA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20090243118
- Publication date Oct 1, 2009
- RENESAS TECHNOLOGY CORP.
- Toshihiko AKIBA
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080006947
- Publication date Jan 10, 2008
- RENESAS TECHNOLOGY CORP.
- Toshihiko Akiba
- G11 - INFORMATION STORAGE

Toshihiko AKIBA

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor device

Manufacturing method of semiconductor device

Method of manufacturing semiconductor device

Semiconductor device with bond pad wiring lead-out arrangement avoi...

Method of manufacturing semiconductor device

Semiconductor device with bond pad wiring lead-out arrangement avoi...

Bonding wire to bonding pad

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method of the same

Manufacturing method of semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device and manufacturing method of the same

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH BOND PAD WIRING LEAD-OUT ARRANGEMENT AVOI...

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Method of Manufacturing Semiconductor Device

Manufacturing Method of Semiconductor Device

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Manufacturing Method of Semiconductor Device

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device and method of manufacturing the same