Toshihiko Ito

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Photo-cured film, and photosensitive element, printed wiring board...
- Patent number 7,071,243
- Issue date Jul 4, 2006
- Hitachi Chemical Company, Ltd.
- Kuniaki Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photo-cured film, and photosensitive element, printed wiring board...
- Patent number 6,692,793
- Issue date Feb 17, 2004
- Hitachi Chemical Company, Ltd.
- Kuniaki Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photo curable resin composition and photosensitive element
- Patent number 6,583,198
- Issue date Jun 24, 2003
- Hitachi Chemical Company, Ltd.
- Kuniaki Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin composition
- Patent number 6,238,840
- Issue date May 29, 2001
- Hitachi Chemical Company, Ltd.
- Takao Hirayama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Bonding film for printed circuit boards
- Patent number 5,885,723
- Issue date Mar 23, 1999
- Hitachi Chemical Company, Ltd.
- Atsushi Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy-modified polyamide resin
- Patent number 5,874,518
- Issue date Feb 23, 1999
- Hitachi Chemical Company, Ltd.
- Kenji Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Amid group-containing diisocyanates and amide group-containing epox...
- Patent number 5,625,026
- Issue date Apr 29, 1997
- Hitachi Chemical Company, Ltd.
- Kenji Suzuki
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Amide group-containing diisocyanates and amide group-containing epo...
- Patent number 5,591,813
- Issue date Jan 7, 1997
- Hitachi Chemical Company, Ltd.
- Kenji Suzuki
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Coating resin composition
- Patent number 4,795,785
- Issue date Jan 3, 1989
- Hitachi Chemical Company, Ltd.
- Toshihiko Ito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Photo-cured film, and photosensitive element, printed wiring board...
- Publication number 20040214924
- Publication date Oct 28, 2004
- Kuniaki Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photo-cured film, and photosensitive element, printed wiring board...
- Publication number 20020169226
- Publication date Nov 14, 2002
- Kuniaki Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photo-cured film, and photosensitive element, printed wiring board...
- Publication number 20010053437
- Publication date Dec 20, 2001
- Kuniaki Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTO CURABLE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT
- Publication number 20010003759
- Publication date Jun 14, 2001
- KUNIAKI SATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Toshihiko Ito

Person

Patents Grantslast 30 patents

Photo-cured film, and photosensitive element, printed wiring board...

Photo-cured film, and photosensitive element, printed wiring board...

Photo curable resin composition and photosensitive element

Photosensitive resin composition

Bonding film for printed circuit boards

Epoxy-modified polyamide resin

Amid group-containing diisocyanates and amide group-containing epox...

Amide group-containing diisocyanates and amide group-containing epo...

Coating resin composition

Patents Applicationslast 30 patents

Photo-cured film, and photosensitive element, printed wiring board...

Photo-cured film, and photosensitive element, printed wiring board...

Photo-cured film, and photosensitive element, printed wiring board...

PHOTO CURABLE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT