Claims
- 1. A photo curable resin composition, which provides a cured film having an elastic modulus of 1 to 100 MPa in dynamic viscoelasticity measurement in a region of 200° to 220° C.
- 2. A photo curable resin composition, which comprises (A) acid-modified vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, wherein the acid-modified vinyl group-containing epoxy resin (A) is a resin obtained by reacting at least one resin (a) selected from the group consisting of novolak epoxy resin represented by the following formula (I), bisphenol A epoxy resin or bisphenol F epoxy resin represented by the following formula (II) and salicylaldehyde epoxy resin represented by the formula (III) with a vinyl group-containing monocarboxylic acid (b) and further reacting the resulting resin with a saturated group of unsaturated group-containing polybasic acid anhydride (c),
- 3. A photo curable resin composition according to claim 2, wherein the elastomer (B) is at least one member selected from the group consisting of styrene-based elastomers, olefinic elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic elastomers and silicone-based elastomers.
- 4. A photosensitive element, which comprises a support and a layer of photocurable resin composition of claim 3 laid on the support.
- 5. A photo curable resin composition according to claim 2, wherein the component (B) is contained in an amount of 2 to 30 parts by weight per 100 parts by weight of the component (A), the component (C) is contained in an amount of 0.5 to 20 parts by weight, the component (D) is contained in an amount of 5 to 80 parts by weight, and the component (E) is contained in an amount of 2 to 50 parts by weight, based on 100 parts by weight of the composition, respectively.
- 6. A photosensitive element, which comprises a support and a layer of photocurable resin composition of claim 2 laid on the support.
- 7. A photo curable resin composition, which comprises (A) acid-modified vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, wherein the elastomer (B) is at least one member selected from the group consisting of styrene-based elastomers, olefinic elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic elastomers and silicone-based elastomers.
Priority Claims (1)
Number |
Date |
Country |
Kind |
09-329294 |
Nov 1997 |
JP |
|
Parent Case Info
[0001] This application is a Divisional application of application Ser. No. 09/198,333, filed Nov. 24, 1998.
Divisions (2)
|
Number |
Date |
Country |
Parent |
09897614 |
Jul 2001 |
US |
Child |
10133504 |
Apr 2002 |
US |
Parent |
09198333 |
Nov 1998 |
US |
Child |
09897614 |
Jul 2001 |
US |