Toshihiko Takakura

Person

Koganei, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor integrated circuit device and process for manufacturi...
- Patent number 6,501,115
- Issue date Dec 31, 2002
- Hitachi, Ltd.
- Makoto Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and process for manufacture...
- Patent number 6,420,227
- Issue date Jul 16, 2002
- Hitachi, Ltd.
- Makoto Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and process for manufacturi...
- Patent number 6,329,680
- Issue date Dec 11, 2001
- Hitachi, Ltd.
- Makoto Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with constant width de...
- Patent number 5,200,348
- Issue date Apr 6, 1993
- Hatachi, Ltd.
- Akihisa Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing semiconductor integrated circuit device ha...
- Patent number 5,141,888
- Issue date Aug 25, 1992
- Hitachi, Ltd.
- Mikinori Kawaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor substrate, and semiconductor...
- Patent number 5,084,402
- Issue date Jan 28, 1992
- Hitachi, Ind.
- Akihisa Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing semiconductor integrated circuit device an...
- Patent number 5,011,788
- Issue date Apr 30, 1991
- Hitachi, Ltd.
- Mikinori Kawaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor body, and device formed therefrom, having grooves wit...
- Patent number 4,907,063
- Issue date Mar 6, 1990
- Hitachi, Ltd.
- Daisuke Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor integrated circuit device ha...
- Patent number 4,853,343
- Issue date Aug 1, 1989
- Hitachi, Ltd.
- Akihisa Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor IC with dual groove isolation
- Patent number 4,819,054
- Issue date Apr 4, 1989
- Hitachi, Ltd.
- Mikinori Kawaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation regions formed by locos followed with groove etch and refill
- Patent number 4,746,963
- Issue date May 24, 1988
- Hitachi, Ltd.
- Akihisa Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming extrinsic base by diffusion from polysilicon/sili...
- Patent number 4,729,965
- Issue date Mar 8, 1988
- Hitachi, Ltd.
- Yoichi Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming trench isolation in an integrated circuit
- Patent number 4,700,464
- Issue date Oct 20, 1987
- Hitachi, Ltd.
- Daisuke Okada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240097013
- Publication date Mar 21, 2024
- THE UNIVERSITY OF TOKYO
- Toshiro Hiramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and process for manufacturi...
- Publication number 20020030213
- Publication date Mar 14, 2002
- Makoto Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Toshihiko Takakura

Person

Patents Grantslast 30 patents

Semiconductor integrated circuit device and process for manufacturi...

Semiconductor integrated circuit device and process for manufacture...

Semiconductor integrated circuit device and process for manufacturi...

Method of manufacturing semiconductor device with constant width de...

Process of manufacturing semiconductor integrated circuit device ha...

Method of fabricating a semiconductor substrate, and semiconductor...

Process of manufacturing semiconductor integrated circuit device an...

Semiconductor body, and device formed therefrom, having grooves wit...

Method for fabricating a semiconductor integrated circuit device ha...

Semiconductor IC with dual groove isolation

Isolation regions formed by locos followed with groove etch and refill

Method of forming extrinsic base by diffusion from polysilicon/sili...

Method of forming trench isolation in an integrated circuit

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Semiconductor integrated circuit device and process for manufacturi...