TREA

Toshihiko Toyama

Follow

Person

  • Tokyo, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Wire bonding apparatus, method for measuring opening amount of clam...
    • Patent number 12,087,725
    • Issue date Sep 10, 2024
    • Shinkawa Ltd.
    • Toshihiko Toyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 8,678,266
    • Issue date Mar 25, 2014
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus and wire bonding method
    • Patent number 8,191,759
    • Issue date Jun 5, 2012
    • Shinkawa Ltd.
    • Shinsuke Tei
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing semiconductor device
    • Patent number 7,910,472
    • Issue date Mar 22, 2011
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device and wire bonding method
    • Patent number 7,808,116
    • Issue date Oct 5, 2010
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 7,621,436
    • Issue date Nov 24, 2009
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus and method
    • Patent number 6,491,202
    • Issue date Dec 10, 2002
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,467,679
    • Issue date Oct 22, 2002
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRE TENSION ADJUSTMENT METHOD AND WIRE TENSION ADJUSTER
    • Publication number 20240297055
    • Publication date Sep 5, 2024
    • SHINKAWA LTD.
    • Toshihiko TOYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
    • Publication number 20230282613
    • Publication date Sep 7, 2023
    • SHINKAWA LTD.
    • Toshihiko Toyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...
    • Publication number 20220310552
    • Publication date Sep 29, 2022
    • SHINKAWA LTD.
    • Toshihiko TOYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMP FORMING METHOD, BUMP FORMING APPARATUS, AND SEMICONDUCTOR DEVI...
    • Publication number 20160358883
    • Publication date Dec 8, 2016
    • SHINKAWA LTD.
    • HIROAKI YOSHINO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING APPARATUS AND WIRE BONDING METHOD
    • Publication number 20110278349
    • Publication date Nov 17, 2011
    • SHINKAWA LTD.
    • Shinsuke Tei
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of manufacturing semiconductor device
    • Publication number 20100248470
    • Publication date Sep 30, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding method
    • Publication number 20100155455
    • Publication date Jun 24, 2010
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding method
    • Publication number 20090194577
    • Publication date Aug 6, 2009
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device and wire bonding method
    • Publication number 20080197510
    • Publication date Aug 21, 2008
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for forming a stud bump
    • Publication number 20070187467
    • Publication date Aug 16, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Toshihiko Toyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding method
    • Publication number 20070108256
    • Publication date May 17, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding method
    • Publication number 20060186177
    • Publication date Aug 24, 2006
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding method
    • Publication number 20060175383
    • Publication date Aug 10, 2006
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding method
    • Publication number 20010042777
    • Publication date Nov 22, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Ryuichi Kyomasu
    • H01 - BASIC ELECTRIC ELEMENTS