Toshihiro Hosoi

Person

Ageo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition comprising coated metal oxide particles, resin-at...
- Patent number 12,139,592
- Issue date Nov 12, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper-clad laminate
- Patent number 11,950,376
- Issue date Apr 2, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin layered product, dielectric layer, metal foil with resin, cap...
- Patent number 11,890,853
- Issue date Feb 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Double-sided copper-clad laminate
- Patent number 11,670,455
- Issue date Jun 6, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Ryuji Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, copper foil with resin, dielectric layer, copper...
- Patent number 11,310,910
- Issue date Apr 19, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-clad copper foil, copper-clad laminated plate, and printed wi...
- Patent number 11,166,383
- Issue date Nov 2, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper clad laminate for forming of embedded capacitor layer, multi...
- Patent number 10,524,360
- Issue date Dec 31, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper clad laminate provided with protective layer and multilayere...
- Patent number 10,244,640
- Issue date Mar 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper clad laminate for forming of embedded capacitor layer, multi...
- Patent number 9,924,597
- Issue date Mar 20, 2018
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, RESIN-ATTACHED METAL FOIL, METAL-CLAD LAMINATED...
- Publication number 20230365784
- Publication date Nov 16, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Toshihiro HOSOI
- B32 - LAYERED PRODUCTS
Information Patent Application
DOUBLE-SIDED COPPER-CLAD LAMINATE
- Publication number 20230238181
- Publication date Jul 27, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Ryuji ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN LAYERED PRODUCT, DIELECTRIC LAYER, METAL FOIL WITH RESIN, CAP...
- Publication number 20230107922
- Publication date Apr 6, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- B32 - LAYERED PRODUCTS
Information Patent Application
DOUBLE-SIDED COPPER-CLAD LAMINATE
- Publication number 20220351906
- Publication date Nov 3, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Ryuji ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...
- Publication number 20220162418
- Publication date May 26, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Toshihiro HOSOI
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER-CLAD LAMINATE
- Publication number 20210029823
- Publication date Jan 28, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Toshihiro HOSOI
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...
- Publication number 20200362169
- Publication date Nov 19, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...
- Publication number 20200008298
- Publication date Jan 2, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN-CLAD COPPER FOIL, COPPER-CLAD LAMINATED PLATE, AND PRINTED WI...
- Publication number 20180206345
- Publication date Jul 19, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...
- Publication number 20180160536
- Publication date Jun 7, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Fujio KUWAKO
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER CLAD LAMINATE PROVIDED WITH PROTECTIVE LAYER AND MULTILAYERE...
- Publication number 20160360624
- Publication date Dec 8, 2016
- Mitsui Mining and Smelting Co., Ltd.
- Fujio KUWAKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...
- Publication number 20160330839
- Publication date Nov 10, 2016
- Mitsui Mining and Smelting Co., Ltd.
- Fujio KUWAKO
- B32 - LAYERED PRODUCTS
Information Patent Application
Lead Frame and Method of Producing Lead Frame
- Publication number 20110272768
- Publication date Nov 10, 2011
- SUN-A CORPORATION
- Toshimi Nakamura
- G01 - MEASURING TESTING

Toshihiro Hosoi

Person

Patents Grantslast 30 patents

Resin composition comprising coated metal oxide particles, resin-at...

Copper-clad laminate

Resin layered product, dielectric layer, metal foil with resin, cap...

Double-sided copper-clad laminate

Resin composition, copper foil with resin, dielectric layer, copper...

Resin-clad copper foil, copper-clad laminated plate, and printed wi...

Copper clad laminate for forming of embedded capacitor layer, multi...

Copper clad laminate provided with protective layer and multilayere...

Copper clad laminate for forming of embedded capacitor layer, multi...

Patents Applicationslast 30 patents

RESIN COMPOSITION, RESIN-ATTACHED METAL FOIL, METAL-CLAD LAMINATED...

DOUBLE-SIDED COPPER-CLAD LAMINATE

RESIN LAYERED PRODUCT, DIELECTRIC LAYER, METAL FOIL WITH RESIN, CAP...

DOUBLE-SIDED COPPER-CLAD LAMINATE

RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...

COPPER-CLAD LAMINATE

RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...

RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...

RESIN-CLAD COPPER FOIL, COPPER-CLAD LAMINATED PLATE, AND PRINTED WI...

COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...

COPPER CLAD LAMINATE PROVIDED WITH PROTECTIVE LAYER AND MULTILAYERE...

COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...

Lead Frame and Method of Producing Lead Frame