Toshihiro Kato

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Chigasaki, JP

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Patents Grantslast 30 patents

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Lead frame having at least two islands and resin molded semiconduct...
- Patent number 5,126,823
- Issue date Jun 30, 1992
- Kabushiki Kaisha Toshiba
- Masashi Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed thermally conductive packaged semiconductor devices
- Patent number 4,924,351
- Issue date May 8, 1990
- Kabushiki Kaisha Toshiba
- Toshihiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding means having an improved capillary and method...
- Patent number 4,911,350
- Issue date Mar 27, 1990
- Kabushiki Kaisha Toshiba
- Kouji Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor hall element with magnetic powder in resin
- Patent number 4,905,318
- Issue date Feb 27, 1990
- Kabushiki Kaisha Toshiba
- Toshikazu Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for inspecting semiconductor devices for their...
- Patent number 4,874,956
- Issue date Oct 17, 1989
- Kabushiki Kaisha Toshiba
- Toshihiro Kato
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 4,722,130
- Issue date Feb 2, 1988
- Kabushiki Kaisha Toshiba
- Takashi Kimura
- B28 - WORKING CEMENT, CLAY, OR STONE