Toshihisa Sato

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for mounting and removing an electronic component
- Patent number 7,299,965
- Issue date Nov 27, 2007
- Fujitsu Limited
- Toshihisa Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package, method of production of same, printed circui...
- Publication number 20080006915
- Publication date Jan 10, 2008
- FUJITSU LIMITED
- Naoaki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate with stiffener and manufacturing method thereof
- Publication number 20080002374
- Publication date Jan 3, 2008
- FUJITSU LIMITED
- Kenji Fukuzono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat conductive bonding material, semiconductor package, heat sprea...
- Publication number 20070228530
- Publication date Oct 4, 2007
- FUJITSU LIMITED
- Toshihisa Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070018310
- Publication date Jan 25, 2007
- FUJITSU LIMITED
- Toshihisa Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component package including joint material having higher...
- Publication number 20070012477
- Publication date Jan 18, 2007
- FUJITSU LIMITED
- Naoaki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MOUNTING AND REMOVING AN ELECTRONIC COMPONENT
- Publication number 20060196912
- Publication date Sep 7, 2006
- FUJITSU LIMITED
- Toshihisa Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for mounting and removing an electronic component
- Publication number 20060076388
- Publication date Apr 13, 2006
- FUJITSU LIMITED
- Toshihisa Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Toshihisa Sato

Person

Patents Grantslast 30 patents

Method and apparatus for mounting and removing an electronic component

Patents Applicationslast 30 patents

Semiconductor package, method of production of same, printed circui...

Substrate with stiffener and manufacturing method thereof

Heat conductive bonding material, semiconductor package, heat sprea...

Semiconductor device and manufacturing method thereof

Electronic component package including joint material having higher...

METHOD AND APPARATUS FOR MOUNTING AND REMOVING AN ELECTRONIC COMPONENT

Method and apparatus for mounting and removing an electronic component