Toshiki Hara

Person

Suwa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid ejecting head, liquid ejecting apparatus, and piezoelectric...
- Patent number 10,391,769
- Issue date Aug 27, 2019
- Seiko Epson Corporation
- Ichiro Asaoka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for evaluating piezoelectric film, piezoelectric element, li...
- Patent number 10,096,766
- Issue date Oct 9, 2018
- Seiko Epson Corporation
- Masayuki Omoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Thermoelectric conversion element and pyroelectric sensor
- Patent number 9,735,335
- Issue date Aug 15, 2017
- Seiko Epson Corporation
- Takayuki Yonemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric element, liquid ejecting head, and liquid ejecting ap...
- Patent number 8,827,430
- Issue date Sep 9, 2014
- Seiko Epson Corporation
- Toshiki Hara
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Piezoelectric element, liquid ejecting head, and liquid ejecting ap...
- Patent number 8,573,751
- Issue date Nov 5, 2013
- Seiko Epson Corporation
- Koichi Morozumi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Piezoelectric element, piezoelectric actuator, liquid ejecting head...
- Patent number 8,567,919
- Issue date Oct 29, 2013
- Seiko Epson Corporation
- Koichi Morozumi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid ejecting head and liquid ejecting apparatus
- Patent number 8,376,527
- Issue date Feb 19, 2013
- Seiko Epson Corporation
- Jiro Kato
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wiring substrate, method of manufacturing wiring substrate, and ele...
- Patent number 8,127,438
- Issue date Mar 6, 2012
- Seiko Epson Corporation
- Toshiki Hara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device, electro-optical device, and method for manufa...
- Patent number 7,855,107
- Issue date Dec 21, 2010
- Seiko Epson Corporation
- Toshiki Hara
- G02 - OPTICS
Information Patent Grant
Method for manufacturing a wiring substrate
- Patent number 7,841,077
- Issue date Nov 30, 2010
- Seiko Epson Corporation
- Toshiki Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor substrate and method for man...
- Patent number 7,592,208
- Issue date Sep 22, 2009
- Seiko Epson Corporation
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor substrates and semiconductor...
- Patent number 7,553,713
- Issue date Jun 30, 2009
- Seiko Epson Corporation
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor substrate and method of manuf...
- Patent number 7,541,258
- Issue date Jun 2, 2009
- Seiko Epson Corporation
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,534,687
- Issue date May 19, 2009
- Seiko Epson Corporation
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 7,465,641
- Issue date Dec 16, 2008
- Seiko Epson Corporation
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor apparatus having drain/sourc...
- Patent number 7,316,943
- Issue date Jan 8, 2008
- Seiko Epson Corporation
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,271,447
- Issue date Sep 18, 2007
- Seiko Epson Corporation
- Teruo Takizawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PIEZOELECTRIC ELEMENT AND PIEZOELECTRIC DEVICE
- Publication number 20230006128
- Publication date Jan 5, 2023
- SEIKO EPSON CORPORATION
- Toshiki HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC...
- Publication number 20180370236
- Publication date Dec 27, 2018
- SEIKO EPSON CORPORATION
- Ichiro ASAOKA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
DISPERSANT AND PRINTING INK COMPOSITION
- Publication number 20180273763
- Publication date Sep 27, 2018
- SEIKO EPSON CORPORATION
- Yoshifumi ITO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR EVALUATING PIEZOELECTRIC FILM, PIEZOELECTRIC ELEMENT, LI...
- Publication number 20180145246
- Publication date May 24, 2018
- SEIKO EPSON CORPORATION
- Masayuki OMOTO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
THERMOELECTRIC CONVERSION ELEMENT AND PYROELECTRIC SENSOR
- Publication number 20160351778
- Publication date Dec 1, 2016
- SEIKO EPSON CORPORATION
- Takayuki YONEMURA
- G01 - MEASURING TESTING
Information Patent Application
LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
- Publication number 20110169898
- Publication date Jul 14, 2011
- SEIKO EPSON CORPORATION
- Jiro KATO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PIEZOELECTRIC ELEMENT, LIQUID EJECTING HEAD, AND LIQUID EJECTING AP...
- Publication number 20110074889
- Publication date Mar 31, 2011
- SEIKO EPSON CORPORATION
- Toshiki HARA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ACTUATOR, LIQUID EJECTING HEAD...
- Publication number 20110063377
- Publication date Mar 17, 2011
- SEIKO EPSON CORPORATION
- Koichi MOROZUMI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PIEZOELECTRIC ELEMENT, LIQUID EJECTING HEAD, AND LIQUID EJECTING AP...
- Publication number 20110063376
- Publication date Mar 17, 2011
- SEIKO EPSON CORPORATION
- Koichi MOROZUMI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFA...
- Publication number 20100212129
- Publication date Aug 26, 2010
- SEIKO EPSON CORPORATION
- Toshiki HARA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC...
- Publication number 20080173468
- Publication date Jul 24, 2008
- SEIKO EPSON CORPORATION
- Toshiki HARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND ELE...
- Publication number 20080110017
- Publication date May 15, 2008
- SEIKO EPSON CORPORATION
- Toshiki HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20080012012
- Publication date Jan 17, 2008
- SEIKO EPSON CORPORATION
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFA...
- Publication number 20080012121
- Publication date Jan 17, 2008
- SEIKO EPSON CORPORATION
- Toshiki Hara
- G02 - OPTICS
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20070296000
- Publication date Dec 27, 2007
- SEIKO EPSON CORPORATION
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor substrate, method of manufact...
- Publication number 20070170579
- Publication date Jul 26, 2007
- SEIKO EPSON CORPORATION
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor substrate and a method for...
- Publication number 20070170468
- Publication date Jul 26, 2007
- SEIKO EPSON CORPORATION
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and semiconductor device manufacturing method
- Publication number 20070075317
- Publication date Apr 5, 2007
- SEIKO EPSON CORPORATION
- Juri Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAN...
- Publication number 20070045739
- Publication date Mar 1, 2007
- SEIKO EPSON CORPORATION
- Toshiki HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor apparatus and the semiconduc...
- Publication number 20070020828
- Publication date Jan 25, 2007
- SEIKO EPSON CORPORATION
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and semiconductor device manufacturing method
- Publication number 20070018246
- Publication date Jan 25, 2007
- SEIKO EPSON CORPORATION
- Juri Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20070013005
- Publication date Jan 18, 2007
- SEIKO EPSON CORPORATION
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20060223270
- Publication date Oct 5, 2006
- SEIKO EPSON CORPORATION
- Toshiki Hara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20060223271
- Publication date Oct 5, 2006
- SEIKO EPSON CORPORATION
- Toshiki Hara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method of manufacturing semiconductor substrate and method of manuf...
- Publication number 20060115935
- Publication date Jun 1, 2006
- SEIKO EPSON CORPORATION
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate, semiconductor device, method of manufactur...
- Publication number 20060091426
- Publication date May 4, 2006
- SEIKO EPSON CORPORATION
- Toshiki Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate, semiconductor device, method of manufactur...
- Publication number 20060060921
- Publication date Mar 23, 2006
- Teruo Takizawa
- H01 - BASIC ELECTRIC ELEMENTS

Toshiki Hara

Person

Patents Grantslast 30 patents

Liquid ejecting head, liquid ejecting apparatus, and piezoelectric...

Method for evaluating piezoelectric film, piezoelectric element, li...

Thermoelectric conversion element and pyroelectric sensor

Piezoelectric element, liquid ejecting head, and liquid ejecting ap...

Piezoelectric element, liquid ejecting head, and liquid ejecting ap...

Piezoelectric element, piezoelectric actuator, liquid ejecting head...

Liquid ejecting head and liquid ejecting apparatus

Wiring substrate, method of manufacturing wiring substrate, and ele...

Semiconductor device, electro-optical device, and method for manufa...

Method for manufacturing a wiring substrate

Method for manufacturing semiconductor substrate and method for man...

Method of manufacturing semiconductor substrates and semiconductor...

Method of manufacturing semiconductor substrate and method of manuf...

Semiconductor device and method for manufacturing the same

Method for manufacturing a semiconductor device

Method for manufacturing semiconductor apparatus having drain/sourc...

Semiconductor device

Patents Applicationslast 30 patents

PIEZOELECTRIC ELEMENT AND PIEZOELECTRIC DEVICE

LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC...

DISPERSANT AND PRINTING INK COMPOSITION

METHOD FOR EVALUATING PIEZOELECTRIC FILM, PIEZOELECTRIC ELEMENT, LI...

THERMOELECTRIC CONVERSION ELEMENT AND PYROELECTRIC SENSOR

LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

PIEZOELECTRIC ELEMENT, LIQUID EJECTING HEAD, AND LIQUID EJECTING AP...

PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ACTUATOR, LIQUID EJECTING HEAD...

PIEZOELECTRIC ELEMENT, LIQUID EJECTING HEAD, AND LIQUID EJECTING AP...

METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND METHOD FOR MANUFA...

WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC...

WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND ELE...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE, ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFA...

Method for manufacturing a semiconductor device

Method of manufacturing semiconductor substrate, method of manufact...

Method for manufacturing a semiconductor substrate and a method for...

Semiconductor device and semiconductor device manufacturing method

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAN...

Method for manufacturing semiconductor apparatus and the semiconduc...

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and method for manufacturing the same

Method of manufacturing semiconductor device

Method for manufacturing a semiconductor device

Method of manufacturing semiconductor substrate and method of manuf...

Semiconductor substrate, semiconductor device, method of manufactur...

Semiconductor substrate, semiconductor device, method of manufactur...