Toshimi Aoyama

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Photosensitive resin composition and flexographic resin plate
- Patent number 6,291,133
- Issue date Sep 18, 2001
- Tokyo Ohka Kogyo Co. Ltd.
- Toshiya Takagi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin composition containing a triazine compound and...
- Patent number 6,010,824
- Issue date Jan 4, 2000
- Tokyo Ohka Kogyo Co., Ltd.
- Hiroshi Komano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for the production of printing plates
- Patent number 5,645,974
- Issue date Jul 8, 1997
- Tokyo Ohka Kogyo, K.K.
- Katsuyuki Ohta
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of bonding circuit boards
- Patent number 5,545,281
- Issue date Aug 13, 1996
- NEC Corporation
- Koji Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photopolymerizable compositions
- Patent number 5,541,038
- Issue date Jul 30, 1996
- Ciba-Geigy Corporation
- Katsuyuki Ohta
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition used in a method for forming a lig...
- Patent number 5,498,498
- Issue date Mar 12, 1996
- Tokyo Ohka Kogyo Co., Ltd.
- Kiyoshi Uchikawa
- G02 - OPTICS
Information Patent Grant
Photosensitive resin composition for use as a light-shielding film...
- Patent number 5,368,991
- Issue date Nov 29, 1994
- Tokyo Ohka Kogyo Co., Ltd.
- Kiyoshi Uchikawa
- G02 - OPTICS
Information Patent Grant
Method of bonding circuit boards
- Patent number 5,318,651
- Issue date Jun 7, 1994
- NEC Corporation
- Koji Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remover solution for photoresist
- Patent number 5,185,235
- Issue date Feb 9, 1993
- Tokyo Ohka Kogyo Co., Ltd.
- Hiromitsu Sato
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition
- Patent number 5,087,552
- Issue date Feb 11, 1992
- Tokyo Ohka Kogyo Co., Ltd.
- Tomoki Horigome
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Water based photopolymerizable resin composition
- Patent number 4,933,260
- Issue date Jun 12, 1990
- Tokyo Ohka Kogyo Co., Ltd.
- Naoya Katsumata
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for prevention of resin plate surface sticking
- Patent number 4,767,642
- Issue date Aug 30, 1988
- Photopoly Ohka Co., Ltd.
- Takaaki Shimizu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for providing a pattern-wise photoresist layer on a substrat...
- Patent number 4,557,996
- Issue date Dec 10, 1985
- Photopoly Ohka Co., Ltd.
- Toshimi Aoyama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for producing gravure printing plates
- Patent number 4,384,011
- Issue date May 17, 1983
- Dai Nippon Insatsu Kabushiki Kaisha
- Toshimi Aoyama
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Soluble photosensitive resin composition
- Patent number 4,209,581
- Issue date Jun 24, 1980
- Tokyo Ohka Kogyo Kabushiki Kaisha
- Hiroshi Takanashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Photosensitive resin composition and resin plate for flexography
- Publication number 20010033981
- Publication date Oct 25, 2001
- Tokyo Ohka Kogyo Co., Ltd.
- Toshiya Takagi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Toshimi Aoyama

Person

Patents Grantslast 30 patents

Photosensitive resin composition and flexographic resin plate

Photosensitive resin composition containing a triazine compound and...

Process for the production of printing plates

Method of bonding circuit boards

Photopolymerizable compositions

Photosensitive resin composition used in a method for forming a lig...

Photosensitive resin composition for use as a light-shielding film...

Method of bonding circuit boards

Remover solution for photoresist

Photosensitive resin composition

Water based photopolymerizable resin composition

Method for prevention of resin plate surface sticking

Method for providing a pattern-wise photoresist layer on a substrat...

Process for producing gravure printing plates

Soluble photosensitive resin composition

Patents Applicationslast 30 patents

Photosensitive resin composition and resin plate for flexography