Toshimitsu Ishikawa

Person

Kawaguchi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plastic mold type semiconductor device
- Patent number 6,194,779
- Issue date Feb 27, 2001
- Kabushiki Kaisha Toshiba
- Toshimitsu Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-mold type semiconductor device
- Patent number 5,939,792
- Issue date Aug 17, 1999
- Kabushiki Kaisha Toshiba
- Toshimitsu Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with smaller package
- Patent number 5,801,433
- Issue date Sep 1, 1998
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit devices having particular terminal...
- Patent number 5,773,321
- Issue date Jun 30, 1998
- Kabushiki Kaisha Toshiba
- Toshimitsu Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit devices having particular terminal...
- Patent number 5,616,962
- Issue date Apr 1, 1997
- Kabushiki Kaisha Toshiba
- Toshimitsu Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with smaller package having leads with alterna...
- Patent number 5,592,020
- Issue date Jan 7, 1997
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing a semiconductor device
- Patent number 5,362,354
- Issue date Nov 8, 1994
- Kabushiki Kaisha Toshiba
- Hiroyuki Okura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device having power source by-pass conne...
- Patent number 5,276,352
- Issue date Jan 4, 1994
- Kabushiki Kaisha Toshiba
- Kazuichi Komenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic mold type semiconductor device
- Patent number 5,223,740
- Issue date Jun 29, 1993
- Kawasaki Kaisha Toshiba
- Toshimitsu Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS

Toshimitsu Ishikawa

Person

Patents Grantslast 30 patents

Plastic mold type semiconductor device

Resin-mold type semiconductor device

Semiconductor device with smaller package

Semiconductor integrated circuit devices having particular terminal...

Semiconductor integrated circuit devices having particular terminal...

Semiconductor device with smaller package having leads with alterna...

Apparatus for manufacturing a semiconductor device

Resin sealed semiconductor device having power source by-pass conne...

Plastic mold type semiconductor device