Claims
- 1. A plastic mold type semiconductor device comprising:a bed of a lead frame; a semiconductor chip having electrodes on the periphery of an upper surface thereof, said semiconductor chip being supported by the bed and having an edge defining one end of said semiconductor chip, said edge being substantially perpendicular with respect to said upper surface; a mold body in which said semiconductor chip is sealed, said mold body having an interior region defined within said mold body, said interior region being further defined by an upper region above said semiconductor chip and a lower region below said semiconductor chip, said upper region being further defined by a first upper region and a second upper region contiguous with said first upper region and abutting said first upper region along a plane passing through said edge of said semiconductor chip, wherein said plane is perpendicular with respect to said upper surface of said semiconductor surface, and said first upper region extends exteriorly with respect to said semiconductor chip and said second upper region extends above said semiconductor chip; leads, each having an outer lead portion projecting from said mold body and an inner lead portion extending into the upper region of said mold body spatially apart from the upper surface of said semiconductor chip within said mold body, said inner lead portion extending through both said first upper region and said second upper region; and bonding wires for connecting said electrodes of said semiconductor chip to corresponding points on said inner lead portions, said points being located in said first upper region in a location exterior of said semiconductor chip and spatially apart from said semiconductor chip.
- 2. The semiconductor device of claim 1, wherein the electrodes include both power and signal transferring electrodes.
- 3. The semiconductor device of claim 1, wherein an inner end of each of said inner lead portions has an enlarged portion to increase a pull-out resistance of said leads.
- 4. The semiconductor device of claim 3, wherein each of the enlarged portions has a circular shape.
- 5. The semiconductor device of claim 1, wherein each said outer lead portion has a downward bent portion with respect to said semiconductor chip.
- 6. The semiconductor device of claim 4, wherein the enlarged portions are located at an end of said corresponding inner lead that is in said second upper region.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1-306606 |
Nov 1989 |
JP |
|
Parent Case Info
This application is a continuation of application Ser. No. 07/920,168, filed Jul. 27, 1992, now abandoned, which is a continuation of Ser. No. 07/618,896, filed on Nov. 28, 1990, now abandoned.
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Date |
Kind |
4984059 |
Kubota et al. |
Jan 1991 |
|
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Takahashi et al. |
Mar 1993 |
|
5208481 |
Kurita et al. |
May 1993 |
|
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Date |
Country |
0143355 |
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JP |
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Jun 1986 |
JP |
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Dec 1987 |
JP |
1-007628 |
Jan 1989 |
JP |
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Non-Patent Literature Citations (3)
Entry |
Patent Abstracts of Japan, vol. 12, No. 193, Jun. 4, 1988. |
Patent Abstracts of Japan, vol. 13, No. 181, Apr. 27, 1989. |
2-137250 Abstract of Japanese Laid Open Application, filed May 25, 1990. |
Continuations (2)
|
Number |
Date |
Country |
Parent |
07/920168 |
Jul 1992 |
US |
Child |
08/254667 |
|
US |
Parent |
07/618896 |
Nov 1990 |
US |
Child |
07/920168 |
|
US |