Toshinori Kawamura

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Hitachi-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed wiring board and electrolytic etch...
- Patent number 8,366,903
- Issue date Feb 5, 2013
- Hitachi Via Mechanics
- Toshinori Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed wiring board as well as copper-clad...
- Patent number 7,666,320
- Issue date Feb 23, 2010
- Hitachi Via Mechanics, Ltd.
- Toshinori Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SURFACE TREATMENT METHOD FOR COPPER AND SURFACE TREATMENT METHOD FO...
- Publication number 20110036493
- Publication date Feb 17, 2011
- Toshinori Kawamura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for manufacturing printed wiring board and electrolytic etch...
- Publication number 20090084684
- Publication date Apr 2, 2009
- Toshinori Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20070202682
- Publication date Aug 30, 2007
- Kenichi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of printed wiring board as well as copper-clad...
- Publication number 20060270232
- Publication date Nov 30, 2006
- Toshinori Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR