Toshinori Koyama

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 9,820,391
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, electronic component device, and method for manufactu...
- Patent number 9,620,446
- Issue date Apr 11, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device
- Patent number 9,520,352
- Issue date Dec 13, 2016
- Shinko Electric Industries Co., Ltd.
- Hiromu Arisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,455,219
- Issue date Sep 27, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 9,380,707
- Issue date Jun 28, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, semiconductor device, and method of manufacturing...
- Patent number 9,220,167
- Issue date Dec 22, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 9,167,692
- Issue date Oct 20, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure and method of manufacturing th...
- Patent number 7,964,950
- Issue date Jun 21, 2011
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure and method of manufacturing th...
- Patent number 7,691,673
- Issue date Apr 6, 2010
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure in which a semiconductor chip...
- Patent number 7,573,135
- Issue date Aug 11, 2009
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure
- Patent number 7,545,049
- Issue date Jun 9, 2009
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-parts-packaging structure in which a semiconductor chip...
- Patent number 7,498,200
- Issue date Mar 3, 2009
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning method and computer readable medium therefor
- Patent number 7,495,745
- Issue date Feb 24, 2009
- Shinko Electric Industries Co., Ltd.
- Keiji Yoshizawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Maskless direct exposure system and user interface
- Patent number 7,307,691
- Issue date Dec 11, 2007
- Shinko Electric Industries Co., Ltd.
- Kazunari Sekigawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure in which a semiconductor chip...
- Patent number 7,285,862
- Issue date Oct 23, 2007
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts packaging structure and method of manufacturing th...
- Patent number 7,057,290
- Issue date Jun 6, 2006
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and method of fabrication thereof
- Patent number 6,759,600
- Issue date Jul 6, 2004
- Shinko Electric Industries Co., Ltd.
- Toshinori Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing wiring board
- Patent number 6,560,863
- Issue date May 13, 2003
- Shinko Electric Industries, Co., Ltd.
- Toshinori Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing multilayer circuit board
- Patent number 6,350,365
- Issue date Feb 26, 2002
- Shinko Electric Industries Co., Ltd.
- Toshinori Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductor pattern on wiring board
- Patent number 6,254,758
- Issue date Jul 3, 2001
- Shinko Electric Industries Co., Ltd.
- Toshinori Koyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTU...
- Publication number 20160174379
- Publication date Jun 16, 2016
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20160172287
- Publication date Jun 16, 2016
- Shinko Electric Industries Co., Ltd.
- Hiromu Arisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20150282307
- Publication date Oct 1, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate, Semiconductor Device, and Method of Manufacturing...
- Publication number 20150245473
- Publication date Aug 27, 2015
- Shinko Electric Industries Co., LTD.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
- Publication number 20150001738
- Publication date Jan 1, 2015
- Shinko Electric Industries Co., LTD.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140225275
- Publication date Aug 14, 2014
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Wiring Substrate
- Publication number 20140150258
- Publication date Jun 5, 2014
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20090206471
- Publication date Aug 20, 2009
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20080128911
- Publication date Jun 5, 2008
- Shinko Electric Industries Co., Ltd.
- Toshinori Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Patterning method and computer readable medium therefor
- Publication number 20080123070
- Publication date May 29, 2008
- Shinko Electric Industries Co., Ltd.
- Keiji Yoshizawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Electronic parts packaging structure in which a semiconductor chip...
- Publication number 20070224731
- Publication date Sep 27, 2007
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts packaging structure in which a semiconductor chip...
- Publication number 20070222062
- Publication date Sep 27, 2007
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20070013048
- Publication date Jan 18, 2007
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20060145359
- Publication date Jul 6, 2006
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of fabricating wiring board
- Publication number 20060009026
- Publication date Jan 12, 2006
- Shinko Electric Industries Co., Ltd.
- Kumiko Sawaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct exposure system and user interface
- Publication number 20050094120
- Publication date May 5, 2005
- Kazunari Sekigawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20040178510
- Publication date Sep 16, 2004
- Masahiro Sunohara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic parts packaging structure and method of manufacturing th...
- Publication number 20040159933
- Publication date Aug 19, 2004
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board and method of fabrication thereof
- Publication number 20020157864
- Publication date Oct 31, 2002
- Toshinori Koyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Process for producing multilayer circuit board
- Publication number 20020083586
- Publication date Jul 4, 2002
- Takahiro Iijima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method of producing wiring board
- Publication number 20020035784
- Publication date Mar 28, 2002
- Toshinori Koyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Toshinori Koyama

Person

Patents Grantslast 30 patents

Wiring board

Wiring board, electronic component device, and method for manufactu...

Wiring board and semiconductor device

Wiring substrate and method of manufacturing the same

Method of manufacturing wiring substrate

Wiring substrate, semiconductor device, and method of manufacturing...

Wiring board, semiconductor device, and method of manufacturing wir...

Electronic parts packaging structure and method of manufacturing th...

Electronic parts packaging structure and method of manufacturing th...

Electronic parts packaging structure in which a semiconductor chip...

Electronic parts packaging structure

Electronic-parts-packaging structure in which a semiconductor chip...

Patterning method and computer readable medium therefor

Maskless direct exposure system and user interface

Electronic parts packaging structure in which a semiconductor chip...

Electronic parts packaging structure and method of manufacturing th...

Multilayer wiring board and method of fabrication thereof

Method of producing wiring board

Method of producing multilayer circuit board

Method of forming conductor pattern on wiring board

Patents Applicationslast 30 patents

WIRING BOARD, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTU...

WIRING BOARD AND SEMICONDUCTOR DEVICE

WIRING BOARD

Wiring Substrate, Semiconductor Device, and Method of Manufacturing...

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Method of Manufacturing Wiring Substrate

Electronic parts packaging structure and method of manufacturing th...

Semiconductor package and method for manufacturing the same

Patterning method and computer readable medium therefor

Electronic parts packaging structure in which a semiconductor chip...

Electronic parts packaging structure in which a semiconductor chip...

Electronic parts packaging structure and method of manufacturing th...

Electronic parts packaging structure and method of manufacturing th...

Method of fabricating wiring board

Direct exposure system and user interface

Electronic parts packaging structure and method of manufacturing th...

Electronic parts packaging structure and method of manufacturing th...

Multilayer wiring board and method of fabrication thereof

Process for producing multilayer circuit board

Method of producing wiring board