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Toshio Tsuda
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Osaka, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Multilevel semiconductor module and method for fabricating the same
Patent number
7,586,183
Issue date
Sep 8, 2009
Panasonic Corporation
Takeshi Kawabata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-level semiconductor module and method for fabricating the same
Patent number
7,365,416
Issue date
Apr 29, 2008
Matsushita Electric Industrial Co., Ltd.
Takeshi Kawabata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an electrical contact bump
Patent number
5,090,119
Issue date
Feb 25, 1992
Matsushita Electric Industrial Co., Ltd.
Toshio Tsuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical contact bump and a package provided with the same
Patent number
5,014,111
Issue date
May 7, 1991
Matsushita Electric Industrial Co., Ltd.
Toshio Tsuda
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Multilevel semiconductor module and method for fabricating the same
Publication number
20060231939
Publication date
Oct 19, 2006
Takeshi Kawabata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-level semiconductor module and method for fabricating the same
Publication number
20060131740
Publication date
Jun 22, 2006
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Takeshi Kawabata
H01 - BASIC ELECTRIC ELEMENTS