Claims
- 1. A method of forming, on an electrode pad formed on a substrate, an electrical contact bump having a first raised portion attached to the electrode pad and a second raised portion having a shape of a loop formed on the first raised portion, said method comprising the steps of:
- fixedly attaching a ball formed at a free end of a conductive wire held by a capillary to the electrode pad by means of the capillary to form the first raised portion;
- looping the conductive wire above the first raised portion to form a looped portion of the conductive wire by means of the capillary, the looped portion having a fixed end connected to the first raised portion and a free end connected to a portion of the conductive wire extending from the capillary;
- fixedly attaching the free end of the looped portion of the conductive wire to the first raised portion by means of the capillary; and
- cutting the conductive wire extending from the capillary at the free end of the looped portion whereby the second raised portion is formed by the looped portion.
- 2. A method according to claim 1, wherein the conductive wire is of a material selected from the group consisting of gold, copper and aluminum.
- 3. A method according to claim 1, wherein the conductive wire comprises an alloy containing, as a main component, a material selected from the group consisting of gold, copper and aluminum.
- 4. A method off forming, on an electrode pad formed on a substrate, an electrical contact bump having a first raised portion attached to the electrode pad and a second raised portion having a shape of a loop formed on the first raised portion, said method comprising the steps of:
- fixedly attaching a ball formed at a free end of a conductive wire held by a capillary to the electrode pad by means of the capillary to form the first raised portion;
- looping the conductive wire above the first raised portion to form a looped portion of the conductive wire by means of the capillary, the looped portion having a fixed end connected to the first raised portion and a free end connected to a portion of the conductive wire extending from the capillary;
- fixedly attaching the free end of the looped portion of the conductive wire to the electrode pad on which the first raised portion is fixedly attached by means of the capillary; and
- cutting the conductive wire at the free end of the looped portion whereby the second raised portion is formed by the looped portion.
- 5. A method according to claim 4, wherein the conductive wire is of a material selected from the group consisting of gold, copper and aluminum.
- 6. A method according to claim 4, wherein the conductive wire comprises an alloy containing, as a main component, a material selected from the group consisting of gold, copper and aluminum.
Priority Claims (2)
Number |
Date |
Country |
Kind |
62-309805 |
Dec 1987 |
JPX |
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63-184936 |
Jul 1988 |
JPX |
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Parent Case Info
This application is a Rule 1.60 divisional application of application Ser. No. 07/279,101, filed Dec. 2, 1988, now U.S. Pat. No. 5,014,111 issued May 7, 1991.
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Divisions (1)
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Number |
Date |
Country |
Parent |
279101 |
Dec 1988 |
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