Toshiya Akamatsu

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component and electronic device
- Patent number 10,062,658
- Issue date Aug 28, 2018
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic device
- Patent number 10,056,342
- Issue date Aug 21, 2018
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,472,527
- Issue date Oct 18, 2016
- Fujitsu Limited
- Toshiya Akamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 9,412,715
- Issue date Aug 9, 2016
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device and optical module
- Patent number 9,235,001
- Issue date Jan 12, 2016
- Fujitsu Limited
- Shigeaki Sekiguchi
- G02 - OPTICS
Information Patent Grant
Circuit board, semiconductor device, and method of manufacturing se...
- Patent number 8,952,271
- Issue date Feb 10, 2015
- Fujitsu Limited
- Masaharu Furuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 8,901,751
- Issue date Dec 2, 2014
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic apparatus, electronic component-...
- Patent number 8,740,047
- Issue date Jun 3, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 8,692,386
- Issue date Apr 8, 2014
- Fujitsu Limited
- Toshiya Akamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder, soldering method, and semiconductor device
- Patent number 8,673,762
- Issue date Mar 18, 2014
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic apparatus, electronic component-...
- Patent number 8,556,157
- Issue date Oct 15, 2013
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting method of semiconductor element using outside connection p...
- Patent number 7,879,713
- Issue date Feb 1, 2011
- Fujitsu Semiconductor Limited
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering flux and method for bonding semiconductor element
- Patent number 7,743,966
- Issue date Jun 29, 2010
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board for electronic dev...
- Patent number 7,604,152
- Issue date Oct 20, 2009
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting electronic part and paste material
- Patent number 6,796,025
- Issue date Sep 28, 2004
- Fujitsu Limited
- Kazuyuki Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 6,764,938
- Issue date Jul 20, 2004
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 6,608,381
- Issue date Aug 19, 2003
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump transfer plate
- Patent number 6,136,047
- Issue date Oct 24, 2000
- Fujitsu Limited
- Kazuaki Karasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps onto an integrated circuit device
- Patent number 6,008,071
- Issue date Dec 28, 1999
- Fujitsu Limited
- Kazuaki Karasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 5,977,637
- Issue date Nov 2, 1999
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 5,611,481
- Issue date Mar 18, 1997
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PART, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS
- Publication number 20170250153
- Publication date Aug 31, 2017
- Fujitsu Limited
- Ryo Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL STRUCTURE, SEMICONDUCTOR DEVICE, AND TERMINAL FORMING METHOD
- Publication number 20150371962
- Publication date Dec 24, 2015
- FUJITSU LIMITED
- TOSHIYA AKAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND OPTICAL MODULE
- Publication number 20150323738
- Publication date Nov 12, 2015
- Fujitsu Limited
- Shigeaki Sekiguchi
- G02 - OPTICS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20150311171
- Publication date Oct 29, 2015
- FUJITSU LIMITED
- Seiki SAKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150221607
- Publication date Aug 6, 2015
- Fujitsu Limited
- TOSHIYA AKAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20150024555
- Publication date Jan 22, 2015
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SE...
- Publication number 20140103097
- Publication date Apr 17, 2014
- Fujitsu Limited
- Masaharu FURUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...
- Publication number 20140008114
- Publication date Jan 9, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20130164956
- Publication date Jun 27, 2013
- Fujitsu Limited
- Seiki SAKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20130087912
- Publication date Apr 11, 2013
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20120193782
- Publication date Aug 2, 2012
- Fujitsu Limited
- Toshiya Akamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE
- Publication number 20120193800
- Publication date Aug 2, 2012
- FUJITSU LIMITED
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...
- Publication number 20110220398
- Publication date Sep 15, 2011
- Fujitsu Limited
- Seiki Sakuyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDERING FLUX AND METHOD FOR BONDING SEMICONDUCTOR ELEMENT
- Publication number 20100218853
- Publication date Sep 2, 2010
- FUJITSU LIMITED
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SE...
- Publication number 20090090543
- Publication date Apr 9, 2009
- Fujitsu Limited
- Masaharu FURUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting method of semiconductor element and manufacturing method o...
- Publication number 20080124834
- Publication date May 29, 2008
- FUJITSU LIMITED
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soldering flux and method for bonding semiconductor element
- Publication number 20070221710
- Publication date Sep 27, 2007
- FUJITSU LIMITED
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a printed circuit board for electronic dev...
- Publication number 20070090171
- Publication date Apr 26, 2007
- FUJITSU LIMITED
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate with terminal pads having respective single solder bumps...
- Publication number 20050062157
- Publication date Mar 24, 2005
- FUJITSU LIMITED
- Kazuaki Karasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated electronic device having flip-chip connection with circu...
- Publication number 20040209453
- Publication date Oct 21, 2004
- FUJITSU LIMITED
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for mounting electronic part and paste material
- Publication number 20020185309
- Publication date Dec 12, 2002
- FUJITSU LIMITED
- Kazuyuki Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE HAVING FLIP-CHIP CONNECTION WITH CIRCU...
- Publication number 20020050404
- Publication date May 2, 2002
- TOSHIYA AKAMATSU
- H01 - BASIC ELECTRIC ELEMENTS

Toshiya Akamatsu

Person

Patents Grantslast 30 patents

Electronic component and electronic device

Electronic component and electronic device

Semiconductor device and manufacturing method thereof

Semiconductor device, electronic device, and semiconductor device m...

Optical device and optical module

Circuit board, semiconductor device, and method of manufacturing se...

Semiconductor device, electronic device, and semiconductor device m...

Method of manufacturing electronic apparatus, electronic component-...

Semiconductor device, method of manufacturing semiconductor device,...

Solder, soldering method, and semiconductor device

Method of manufacturing electronic apparatus, electronic component-...

Mounting method of semiconductor element using outside connection p...

Soldering flux and method for bonding semiconductor element

Method for manufacturing a printed circuit board for electronic dev...

Method for mounting electronic part and paste material

Integrated electronic device having flip-chip connection with circu...

Integrated electronic device having flip-chip connection with circu...

Solder bump transfer plate

Method of forming solder bumps onto an integrated circuit device

Integrated electronic device having flip-chip connection with circu...

Integrated electronic device having flip-chip connection with circu...

Patents Applicationslast 30 patents

ELECTRONIC PART, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS

TERMINAL STRUCTURE, SEMICONDUCTOR DEVICE, AND TERMINAL FORMING METHOD

OPTICAL DEVICE AND OPTICAL MODULE

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SE...

METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...

SOLDERING FLUX AND METHOD FOR BONDING SEMICONDUCTOR ELEMENT

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SE...

Mounting method of semiconductor element and manufacturing method o...

Soldering flux and method for bonding semiconductor element

Method for manufacturing a printed circuit board for electronic dev...

Substrate with terminal pads having respective single solder bumps...

Integrated electronic device having flip-chip connection with circu...

Method for mounting electronic part and paste material

INTEGRATED ELECTRONIC DEVICE HAVING FLIP-CHIP CONNECTION WITH CIRCU...