Tousaku Nishiyama

Person

Katano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Module with a built-in component, and electronic device with the same
- Patent number 8,064,213
- Issue date Nov 22, 2011
- Panasonic Corporation
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing connection member
- Patent number 7,748,110
- Issue date Jul 6, 2010
- Panasonic Corporation
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with built-in electronic component and method for man...
- Patent number 7,341,890
- Issue date Mar 11, 2008
- Matsushita Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection member and mount assembly and production method of the same
- Patent number 7,258,549
- Issue date Aug 21, 2007
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 7,155,820
- Issue date Jan 2, 2007
- Matsushita Electric Industrial Co., Ltd.
- Daizo Andoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mount assembly, optical transmission line and photoelectric circuit...
- Patent number 7,136,543
- Issue date Nov 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Tousaku Nishiyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Circuit board with built-in electronic component and method for man...
- Patent number 7,091,593
- Issue date Aug 15, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor built-in millimeter-wave band module
- Patent number 7,061,100
- Issue date Jun 13, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hideki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-reception/emission device built-in module with optical and el...
- Patent number 6,885,788
- Issue date Apr 26, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hideki Iwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive agent, packaging structure, and method for manu...
- Patent number 6,814,893
- Issue date Nov 9, 2004
- Matsushita Electric Industiral Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and production method thereof
- Patent number 6,774,316
- Issue date Aug 10, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 6,753,483
- Issue date Jun 22, 2004
- Matsushita Electric Industrial Co., Ltd.
- Daizo Andoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive and packaging structure using the same
- Patent number 6,666,994
- Issue date Dec 23, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive agent, packaging structure, and method for manu...
- Patent number 6,620,345
- Issue date Sep 16, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive and packaging structure using the same
- Patent number 6,524,721
- Issue date Feb 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and assembly of the same
- Patent number 6,324,067
- Issue date Nov 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Tousaku Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape cartridge
- Patent number 5,986,859
- Issue date Nov 16, 1999
- Ikeuchii & Sato
- Tousaku Nishiyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Tape casette with tape cleaners
- Patent number 5,396,392
- Issue date Mar 7, 1995
- Matsushita Electric Industrial Co., Ltd.
- Masaru Watanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Tape cassette
- Patent number 5,372,320
- Issue date Dec 13, 1994
- Matsushita Electic Industrial Co., Ltd.
- Masaru Watanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Tape cassette with resiliently mounted tape cleaner
- Patent number 5,355,271
- Issue date Oct 11, 1994
- Matsushita Electric Industrial Co., Ltd.
- Masaru Watanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Tape cassette structure
- Patent number 5,335,875
- Issue date Aug 9, 1994
- Matsushita Electric Industrial Co., Ltd.
- Masaru Watanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of producing a magnetic recording media
- Patent number 5,229,173
- Issue date Jul 20, 1993
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Suzuki
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Circuit board and method for manufacturing the same, semiconductor...
- Publication number 20080185178
- Publication date Aug 7, 2008
- Matsushita Electric Industrial Co., Ltd.
- Rikiya Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection member and mount assembly and production method of the same
- Publication number 20080047137
- Publication date Feb 28, 2008
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board embedded with spherical semiconductor element
- Publication number 20070069393
- Publication date Mar 29, 2007
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with built-in electronic component and method for man...
- Publication number 20060244119
- Publication date Nov 2, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three-dimensional mounting structure and method for producing the same
- Publication number 20050184372
- Publication date Aug 25, 2005
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection member and mount assembly and production method of the same
- Publication number 20050184381
- Publication date Aug 25, 2005
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module with a built-in component, and electronic device with the same
- Publication number 20050168960
- Publication date Aug 4, 2005
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufacturing the same, semiconductor...
- Publication number 20050124197
- Publication date Jun 9, 2005
- Matsushita Electric Industrial Co., Ltd.
- Rikiya Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connector sheet and wiring board, and production processes of the same
- Publication number 20050057906
- Publication date Mar 17, 2005
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with in-built electronic component and method for man...
- Publication number 20050006142
- Publication date Jan 13, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mount assembly, optical transmission line and photoelectric circuit...
- Publication number 20050002608
- Publication date Jan 6, 2005
- Tousaku Nishiyama
- G02 - OPTICS
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20040089471
- Publication date May 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Daizo Andoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive adhesive agent, packaging structure, and method for manu...
- Publication number 20040005459
- Publication date Jan 8, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD.
- Hiroaki Takezawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Light-reception/emission device built-in module with optical and el...
- Publication number 20040001661
- Publication date Jan 1, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hideki Iwaki
- G02 - OPTICS
Information Patent Application
Semiconductor built -in millimeter-wave band module
- Publication number 20030189246
- Publication date Oct 9, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hideki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive adhesive and packaging structure using the same
- Publication number 20030116756
- Publication date Jun 26, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive adhesive agent, packaging structrue, and method for manu...
- Publication number 20020050643
- Publication date May 2, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroaki Takezawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Conductive adhesive and packaging structure using the same
- Publication number 20020043652
- Publication date Apr 18, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroaki Takezawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Printed circuit board and method of manufacturing the same
- Publication number 20010052425
- Publication date Dec 20, 2001
- Matsushita Electric Industrial Co., Ltd.,
- Daizo Andoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Tousaku Nishiyama

Person

Patents Grantslast 30 patents

Module with a built-in component, and electronic device with the same

Method for producing connection member

Circuit board with built-in electronic component and method for man...

Connection member and mount assembly and production method of the same

Method for manufacturing printed circuit board

Mount assembly, optical transmission line and photoelectric circuit...

Circuit board with built-in electronic component and method for man...

Semiconductor built-in millimeter-wave band module

Light-reception/emission device built-in module with optical and el...

Conductive adhesive agent, packaging structure, and method for manu...

Wiring board and production method thereof

Printed circuit board and method of manufacturing the same

Conductive adhesive and packaging structure using the same

Conductive adhesive agent, packaging structure, and method for manu...

Conductive adhesive and packaging structure using the same

Printed wiring board and assembly of the same

Tape cartridge

Tape casette with tape cleaners

Tape cassette

Tape cassette with resiliently mounted tape cleaner

Tape cassette structure

Method of producing a magnetic recording media

Patents Applicationslast 30 patents

Circuit board and method for manufacturing the same, semiconductor...

Connection member and mount assembly and production method of the same

Wiring board embedded with spherical semiconductor element

Circuit board with built-in electronic component and method for man...

Three-dimensional mounting structure and method for producing the same

Connection member and mount assembly and production method of the same

Module with a built-in component, and electronic device with the same

Circuit board and method for manufacturing the same, semiconductor...

Connector sheet and wiring board, and production processes of the same

Circuit board with in-built electronic component and method for man...

Mount assembly, optical transmission line and photoelectric circuit...

Printed circuit board and method of manufacturing the same

Conductive adhesive agent, packaging structure, and method for manu...

Light-reception/emission device built-in module with optical and el...

Semiconductor built -in millimeter-wave band module

Conductive adhesive and packaging structure using the same

Conductive adhesive agent, packaging structrue, and method for manu...

Conductive adhesive and packaging structure using the same

Printed circuit board and method of manufacturing the same