Claims
- 1. A conductive adhesive for connecting electrically an electronic element and a substrate, comprisingfirst particles for securing electric conductivity, second particles having a standard electrode potential lower than a standard electrode potential of the first particles, and 1 ppm to 10000 ppm of electrolytic ions.
- 2. The conductive adhesive according to claim 1, wherein the second particles comprise at least one element selected from Zn, Fe, Mg, Cu, V, Ca and Be.
- 3. The conductive adhesive according to claim 2, wherein the second particles comprise Zn.
- 4. The conductive adhesive according to claim 1, wherein a content of the first particles ranges from 70 wt % to 95 wt %.
- 5. The conductive adhesive according to claim 1, wherein a content of the second particles is not less than 0.5 wt % and not more than 10 wt %.
- 6. The conductive adhesive according to claim 5, wherein a content of the second particles is more than 2 wt %.
- 7. The conductive adhesive according to claim 1, wherein the standard electrode potential of the second particles is lower than that of Sn.
- 8. The conductive adhesive according to claim 1, wherein the electrolytic ions comprise chloride ions.
- 9. The conductive adhesive according to claim 1, further comprising a binder resin.
- 10. The conductive adhesive according to claim 9, wherein the binder resin is a thermosetting resin.
- 11. The conductive adhesive according to claim 1, further comprising an organic solvent, wherein the content of the organic solvent is in the range of 0.1 wt % to 10 wt %.
- 12. The conductive adhesive according to claim 11, wherein the organic solvent is a polar solvent having a dielectric constant of at least 15.
- 13. The conductive adhesive according to claim 1, further comprising a material for removing a metal oxide film, wherein the material removes or decreases metal oxide films on the surfaces of the second particles.
- 14. The conductive adhesive according to claim 1, further comprising at least one agent selected from an activator and an antioxidant.
- 15. A conductive adhesive for connecting electrically an electronic element and a substrate, comprisingfirst particles for securing electric conductivity, second particles having a standard electrode potential lower than a standard electrode potential of the first particles, and a polar solvent having a dielectric constant of at least 15.
- 16. The conductive adhesive according to claim 15, wherein the second particles comprise at least one element selected from Zn, Fe, Mg, Cu, V, Ca and Be.
- 17. The conductive adhesive according to claim 16, wherein the second particles comprise Zn.
- 18. The conductive adhesive according to claim 15, wherein a content of the first particles ranges from 70 wt % to 95 wt %.
- 19. The conductive adhesive according to claim 15, wherein a content of the second particles is not less than 0.5 wt % and not more than 10 wt %.
- 20. The conductive adhesive according to claim 19, wherein a content of the second particles is more than 2 wt %.
- 21. The conductive adhesive according to claim 15, wherein the standard electrode potential of the second particles is lower than that of Sn.
- 22. The conductive adhesive according to claim 15, further comprising a binder resin.
- 23. The conductive adhesive according to claim 22, wherein the binder resin is a thermosetting resin.
- 24. The conductive adhesive according to claim 15, further comprising a material for removing a metal oxide film, wherein the material removes or decreases metal oxide films on the surfaces of the second particles.
- 25. The conductive adhesive according to claim 15, further comprising at least one agent selected from an activator and an antioxidant.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2000-262244 |
Aug 2000 |
JP |
|
Parent Case Info
This application is a divisional of application Ser. No. 09/898,721, filed Jul. 3, 2001, now U.S. Pat. No. 6,524,721 which application(s) are incorporated herein by reference.
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