Toyokazu Hotchi

Person

Niigata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
NCF for pressure mounting, cured product thereof, and semiconductor...
- Patent number 11,485,848
- Issue date Nov 1, 2022
- Namics Corporation
- Kenichi Tosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,315,846
- Issue date Apr 26, 2022
- Namics Corporation
- Hiroki Myodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition and semiconductor device
- Patent number 10,738,187
- Issue date Aug 11, 2020
- Namics Corporation
- Hiroki Myodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition and method of producing same
- Patent number 10,388,583
- Issue date Aug 20, 2019
- Namics Corporation
- Masaaki Hoshiyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film adhesive and semiconductor device including the same
- Patent number 10,023,775
- Issue date Jul 17, 2018
- Namics Corporation
- Satomi Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of predicting viscosity behavior of thermosetting resin, sim...
- Patent number 9,417,228
- Issue date Aug 16, 2016
- Namics Corporation
- Toshiaki Enomoto
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200227329
- Publication date Jul 16, 2020
- Namics Corporation
- Hiroki MYODO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NCF FOR PRESSURE MOUNTING, CURED PRODUCT THEREOF, AND SEMICONDUCTOR...
- Publication number 20200207977
- Publication date Jul 2, 2020
- NAMICS CORPORATION
- Kenichi Tosaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREFILLED SYRINGE AND PRESERVATION METHOD FOR RESIN COMPOSITE
- Publication number 20200001011
- Publication date Jan 2, 2020
- Namics Corporation
- Hiroki MYODO
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20190100646
- Publication date Apr 4, 2019
- Namics Corporation
- Hiroki MYODO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM ADHESIVE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20180016479
- Publication date Jan 18, 2018
- Satomi KAWAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND METHOD OF PRODUCING SAME
- Publication number 20170301597
- Publication date Oct 19, 2017
- Namics Corporation
- Masaaki Hoshiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREDICTING VISCOSITY BEHAVIOR OF THERMOSETTING RESIN, SIM...
- Publication number 20140316102
- Publication date Oct 23, 2014
- Toshiaki Enomoto
- G01 - MEASURING TESTING

Toyokazu Hotchi

Person

Patents Grantslast 30 patents

NCF for pressure mounting, cured product thereof, and semiconductor...

Semiconductor device

Resin composition and semiconductor device

Thermosetting resin composition and method of producing same

Film adhesive and semiconductor device including the same

Method of predicting viscosity behavior of thermosetting resin, sim...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

NCF FOR PRESSURE MOUNTING, CURED PRODUCT THEREOF, AND SEMICONDUCTOR...

PREFILLED SYRINGE AND PRESERVATION METHOD FOR RESIN COMPOSITE

RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

FILM ADHESIVE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

THERMOSETTING RESIN COMPOSITION AND METHOD OF PRODUCING SAME

METHOD OF PREDICTING VISCOSITY BEHAVIOR OF THERMOSETTING RESIN, SIM...