TREA

Tracy E. Bell

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  • Campbell, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Microcap wafer-level package
    • Patent number 6,429,511
    • Issue date Aug 6, 2002
    • Agilent Technologies, Inc.
    • Richard C. Ruby
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Microcap wafer-level package
    • Patent number 6,376,280
    • Issue date Apr 23, 2002
    • Agilent Technologies, Inc.
    • Richard C. Ruby
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Microcap wafer-level package
    • Patent number 6,265,246
    • Issue date Jul 24, 2001
    • Agilent Technologies, Inc.
    • Richard C. Ruby
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Microcap wafer-level package with vias
    • Patent number 6,228,675
    • Issue date May 8, 2001
    • Agilent Technologies, Inc.
    • Richard C. Ruby
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    Microcap wafer-level package
    • Publication number 20020017713
    • Publication date Feb 14, 2002
    • Richard C. Ruby
    • B81 - MICRO-STRUCTURAL TECHNOLOGY