Travis M. Jensen

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor assemblies with system and methods for conveying sign...
- Patent number 12,230,608
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including a terminal pad associated with a conductive tra...
- Patent number 11,967,572
- Issue date Apr 23, 2024
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with redistribution structures configured for...
- Patent number 11,791,316
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 11,594,432
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Methods for forming substrate terminal pads, related terminal pads...
- Patent number 11,233,024
- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with redistribution structures configured for...
- Patent number 11,171,121
- Issue date Nov 9, 2021
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,998,208
- Issue date May 4, 2021
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,410,891
- Issue date Sep 10, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,090,177
- Issue date Oct 2, 2018
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...
- Publication number 20250046710
- Publication date Feb 6, 2025
- Micron Technology Inc.
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE SEMICONDUCTOR FAN OUT PACKAGE
- Publication number 20240355748
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES...
- Publication number 20240258256
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20240206069
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Bradley Russell BITZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR...
- Publication number 20240055411
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR CONVEYING SIGN...
- Publication number 20230055425
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SUBSTRATE TERMINAL PADS, RELATED TERMINAL PADS...
- Publication number 20220130780
- Publication date Apr 28, 2022
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR...
- Publication number 20220059509
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR...
- Publication number 20210305211
- Publication date Sep 30, 2021
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20210225672
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SUBSTRATE TERMINAL PADS, RELATED TERMINAL PADS...
- Publication number 20210193601
- Publication date Jun 24, 2021
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20190326142
- Publication date Oct 24, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20190067053
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Travis M. Jensen

Person

Patents Grantslast 30 patents

Semiconductor assemblies with system and methods for conveying sign...

Apparatus including a terminal pad associated with a conductive tra...

Semiconductor devices with redistribution structures configured for...

Cold fluid semiconductor device release during pick and place opera...

Methods for forming substrate terminal pads, related terminal pads...

Semiconductor devices with redistribution structures configured for...

Cold fluid semiconductor device release during pick and place opera...

Cold fluid semiconductor device release during pick and place opera...

Cold fluid semiconductor device release during pick and place opera...

Patents Applicationslast 30 patents

DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...

HIGH-PERFORMANCE SEMICONDUCTOR FAN OUT PACKAGE

ASSEMBLY INCLUDING TERMINAL PADS ASSOCIATED WITH CONDUCTIVE TRACES...

PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY

SUBSTRATES WITH CONTINUOUS SLOT VIAS

SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR...

SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR CONVEYING SIGN...

METHODS FOR FORMING SUBSTRATE TERMINAL PADS, RELATED TERMINAL PADS...

SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR...

SEMICONDUCTOR DEVICES WITH REDISTRIBUTION STRUCTURES CONFIGURED FOR...

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

METHODS FOR FORMING SUBSTRATE TERMINAL PADS, RELATED TERMINAL PADS...

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...