Tsang-Yu Liu

Person

Zhubei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package and method for forming the same
- Patent number 12,237,354
- Issue date Feb 25, 2025
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for preventing backside peeling defects on semiconductor...
- Patent number 12,080,587
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,942,563
- Issue date Mar 26, 2024
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,873,212
- Issue date Jan 16, 2024
- Xintec Inc.
- Wei-Luen Suen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package
- Patent number 11,746,003
- Issue date Sep 5, 2023
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,705,368
- Issue date Jul 18, 2023
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package
- Patent number 11,476,293
- Issue date Oct 18, 2022
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,319,208
- Issue date May 3, 2022
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and power module
- Patent number 11,310,904
- Issue date Apr 19, 2022
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical chip package and method for forming the same
- Patent number 11,137,559
- Issue date Oct 5, 2021
- Xintec Inc.
- Jiun-Yen Lai
- G02 - OPTICS
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,121,031
- Issue date Sep 14, 2021
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,107,759
- Issue date Aug 31, 2021
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,950,738
- Issue date Mar 16, 2021
- Xintec Inc.
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 10,833,118
- Issue date Nov 10, 2020
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and system for preventing backside peeling defects on sem...
- Patent number 10,748,806
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 10,461,117
- Issue date Oct 29, 2019
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch panel-sensing chip package module complex and a manufacturing...
- Patent number 10,318,784
- Issue date Jun 11, 2019
- Xintec Inc.
- Shu-Ming Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and system for preventing backside peeling defects on sem...
- Patent number 10,163,676
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale sensing chip package and a manufacturing method thereof
- Patent number 10,152,180
- Issue date Dec 11, 2018
- Xintec Inc.
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging sensing device and method for forming the same
- Patent number 10,140,498
- Issue date Nov 27, 2018
- Xintec Inc.
- Tsang-Yu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,109,663
- Issue date Oct 23, 2018
- Xintec Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 10,109,559
- Issue date Oct 23, 2018
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,096,635
- Issue date Oct 9, 2018
- Xintec Inc.
- Wei-Ming Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 10,049,252
- Issue date Aug 14, 2018
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,050,006
- Issue date Aug 14, 2018
- Xintec Inc.
- Chia-Lun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,997,473
- Issue date Jun 12, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive module and method for forming the same
- Patent number 9,978,788
- Issue date May 22, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive module and method for forming the same
- Patent number 9,966,400
- Issue date May 8, 2018
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing chip package and a manufacturing method thereof
- Patent number 9,887,229
- Issue date Feb 6, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 9,881,889
- Issue date Jan 30, 2018
- Xintec Inc.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250054849
- Publication date Feb 13, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250056911
- Publication date Feb 13, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240304582
- Publication date Sep 12, 2024
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116751
- Publication date Apr 11, 2024
- XINTEC INC.
- Chia-Ming CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240109769
- Publication date Apr 4, 2024
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20230369371
- Publication date Nov 16, 2023
- XINTEC INC.
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369362
- Publication date Nov 16, 2023
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230361144
- Publication date Nov 9, 2023
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230230933
- Publication date Jul 20, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20220285423
- Publication date Sep 8, 2022
- XINTEC INC.
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220219970
- Publication date Jul 14, 2022
- XINTEC INC.
- Tsang-Yu LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20210343591
- Publication date Nov 4, 2021
- XINTEC INC.
- Chia-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210269303
- Publication date Sep 2, 2021
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210104455
- Publication date Apr 8, 2021
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE
- Publication number 20210066379
- Publication date Mar 4, 2021
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210032096
- Publication date Feb 4, 2021
- XINTEC INC.
- Tsang-Yu LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS FOR PREVENTING BACKSIDE PEELING DEFECTS ON SEMICONDUCTOR...
- Publication number 20200381287
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20200333542
- Publication date Oct 22, 2020
- XINTEC INC.
- Jiun-Yen LAI
- G02 - OPTICS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20200144116
- Publication date May 7, 2020
- XINTEC INC.
- Chia-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND POWER MODULE
- Publication number 20200137879
- Publication date Apr 30, 2020
- XINTEC INC.
- Tsang-Yu LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20200044099
- Publication date Feb 6, 2020
- XINTEC INC.
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND SYSTEM FOR PREVENTING BACKSIDE PEELING DEFECTS ON SEM...
- Publication number 20190139810
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180358398
- Publication date Dec 13, 2018
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20180175101
- Publication date Jun 21, 2018
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170213805
- Publication date Jul 27, 2017
- XINTEC INC.
- Chia-Lun SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170207182
- Publication date Jul 20, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170179330
- Publication date Jun 22, 2017
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170117242
- Publication date Apr 27, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20170116458
- Publication date Apr 27, 2017
- XINTEC INC.
- Tsang-Yu LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170092607
- Publication date Mar 30, 2017
- XINTEC INC.
- Hsin KUAN
- H01 - BASIC ELECTRIC ELEMENTS

Tsang-Yu Liu

Person

Patents Grantslast 30 patents

Chip package and method for forming the same

Apparatus for preventing backside peeling defects on semiconductor...

Manufacturing method of chip package and chip package

Chip package and manufacturing method thereof

Chip package

Manufacturing method of chip package and chip package

Manufacturing method of chip package

Chip package and manufacturing method thereof

Chip package and power module

Optical chip package and method for forming the same

Manufacturing method of chip package and chip package

Chip package and manufacturing method thereof

Chip package and method for forming the same

Chip package and manufacturing method thereof

Apparatus and system for preventing backside peeling defects on sem...

Semiconductor structure and method for manufacturing semiconductor...

Touch panel-sensing chip package module complex and a manufacturing...

Apparatus and system for preventing backside peeling defects on sem...

Chip scale sensing chip package and a manufacturing method thereof

Wafer-level packaging sensing device and method for forming the same

Chip package and method for forming the same

Electronic device package and fabrication method thereof

Semiconductor structure and manufacturing method thereof

Chip package and fabrication method thereof

Chip package and method for forming the same

Chip package and method for forming the same

Photosensitive module and method for forming the same

Photosensitive module and method for forming the same

Sensing chip package and a manufacturing method thereof

Chip package and method for fabricating the same

Patents Applicationslast 30 patents

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CHIP PACKAGE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

APPARATUS FOR PREVENTING BACKSIDE PEELING DEFECTS ON SEMICONDUCTOR...

OPTICAL CHIP PACKAGE AND METHOD FOR FORMING THE SAME

MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE

CHIP PACKAGE AND POWER MODULE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

APPARATUS AND SYSTEM FOR PREVENTING BACKSIDE PEELING DEFECTS ON SEM...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SENSING DEVICE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME