Tsong-Lin L. Tai

Person

Stormville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective dopant junction for a group III-V semiconductor device
- Patent number 9,679,775
- Issue date Jun 13, 2017
- International Business Machines Corporation
- Kevin K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure and its formation
- Patent number 9,589,894
- Issue date Mar 7, 2017
- International Business Machines Corporation
- Daniel Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective dopant junction for a group III-V semiconductor device
- Patent number 9,418,846
- Issue date Aug 16, 2016
- International Business Machines Corporation
- Kevin K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure and its formation
- Patent number 8,969,197
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct electroplating of copper onto a non-copper platea...
- Patent number 7,405,153
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Sandra G. Malhotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming low resistance and reliable via in inter-level di...
- Patent number 7,223,691
- Issue date May 29, 2007
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE DOPANT JUNCTION FOR A GROUP III-V SEMICONDUCTOR DEVICE
- Publication number 20160329211
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Kevin K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DOPANT JUNCTION FOR A GROUP III-V SEMICONDUCTOR DEVICE
- Publication number 20160254150
- Publication date Sep 1, 2016
- International Business Machines Corporation
- Kevin K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE AND ITS FORMATION
- Publication number 20140210089
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Daniel Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE AND ITS FORMATION
- Publication number 20130307150
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20080076690
- Publication date Mar 27, 2008
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR DIRECT ELECTROPLATING OF COPPER ONTO A NON-COPPER PLATEA...
- Publication number 20070166995
- Publication date Jul 19, 2007
- International Business Machines Corporation
- Sandra G. Malhotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods of manufacture thereof
- Publication number 20070134861
- Publication date Jun 14, 2007
- Jin-Ping Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming low resistance and reliable via in inter-level di...
- Publication number 20060084256
- Publication date Apr 20, 2006
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20050066995
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Tsong-Lin L. Tai

Person

Patents Grantslast 30 patents

Selective dopant junction for a group III-V semiconductor device

Copper interconnect structure and its formation

Selective dopant junction for a group III-V semiconductor device

Copper interconnect structure and its formation

Method for direct electroplating of copper onto a non-copper platea...

Method of forming low resistance and reliable via in inter-level di...

Patents Applicationslast 30 patents

SELECTIVE DOPANT JUNCTION FOR A GROUP III-V SEMICONDUCTOR DEVICE

SELECTIVE DOPANT JUNCTION FOR A GROUP III-V SEMICONDUCTOR DEVICE

COPPER INTERCONNECT STRUCTURE AND ITS FORMATION

COPPER INTERCONNECT STRUCTURE AND ITS FORMATION

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK

METHOD FOR DIRECT ELECTROPLATING OF COPPER ONTO A NON-COPPER PLATEA...

Semiconductor devices and methods of manufacture thereof

Method of forming low resistance and reliable via in inter-level di...

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK