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Hsinchu, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Thermal management system for multiple heat source devices
Patent number
8,466,486
Issue date
Jun 18, 2013
TSMC Solid State Lighting Ltd.
Tsorng-Dih Yuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip package having enhanced thermal and mechanical performance
Patent number
8,247,900
Issue date
Aug 21, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsorng-Dih Yuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked structures and methods of fabricating stacked structures
Patent number
7,514,775
Issue date
Apr 7, 2009
Taiwan Semiconductor Manufacturing Co., Ltd.
Clinton Chao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of manufacturing thereof
Patent number
7,348,218
Issue date
Mar 25, 2008
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Yu Ni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of manufacturing thereof
Patent number
7,135,769
Issue date
Nov 14, 2006
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Yu Ni
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Thermal management system for multiple heat source devices
Publication number
20120049233
Publication date
Mar 1, 2012
Taiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
Tsorng-Dih Yuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP PACKAGE HAVING ENHANCED THERMAL AND MECHANICAL PERFORMANCE
Publication number
20110156235
Publication date
Jun 30, 2011
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsorng-Dih YUAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES
Publication number
20080083975
Publication date
Apr 10, 2008
Taiwan Semiconductor Manufacturing Co., LTD
Clinton Chao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor packages and methods of manufacturing thereof
Publication number
20060286719
Publication date
Dec 21, 2006
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Yu Ni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Sealing membrane for thermal interface material
Publication number
20060261469
Publication date
Nov 23, 2006
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Yu Ni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
Publication number
20060220225
Publication date
Oct 5, 2006
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Yu Ni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flip chip ball grid array package assemblies and electronic devices...
Publication number
20060118969
Publication date
Jun 8, 2006
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsorng-Dih Yuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermal expansion compensating flip chip ball grid array package st...
Publication number
20060118947
Publication date
Jun 8, 2006
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsorng-Dih Yuan
H01 - BASIC ELECTRIC ELEMENTS