Tsui Yee Lin

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Kowloon, HK

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Patents Grantslast 30 patents

Information Patent Grant
Multiple leadframe laminated IC package
- Patent number 7,449,771
- Issue date Nov 11, 2008
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier and method of fabricating same
- Patent number 7,410,830
- Issue date Aug 12, 2008
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple leadframe laminated IC package
- Patent number 6,734,044
- Issue date May 11, 2004
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless plastic chip carrier with partial etch die attach pad
- Patent number 6,585,905
- Issue date Jul 1, 2003
- ASAT Ltd.
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS