Tsukasa Shiraishi

Person

Takatsuki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,076,752
- Issue date Jul 7, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board connection method
- Patent number 8,353,102
- Issue date Jan 15, 2013
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, method for manufacturing the same, and semiconductor...
- Patent number 8,063,486
- Issue date Nov 22, 2011
- Panasonic Corporation
- Koichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting electronic components, method for forming bum...
- Patent number 7,963,310
- Issue date Jun 21, 2011
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting electronic components, method for forming bum...
- Patent number 7,850,803
- Issue date Dec 14, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method and electronic component mount...
- Patent number 7,752,749
- Issue date Jul 13, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package equipped with semiconductor chip and method for producing same
- Patent number 7,649,267
- Issue date Jan 19, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, mounting circuit board, method of producing t...
- Patent number 6,909,180
- Issue date Jun 21, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing mounting structure and mounting structure produ...
- Patent number 6,818,461
- Issue date Nov 16, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including wiring board with three dimensional...
- Patent number 6,756,663
- Issue date Jun 29, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed-circuit board having projection elec...
- Patent number 6,694,613
- Issue date Feb 24, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including a wiring board and semiconductor ele...
- Patent number 6,525,414
- Issue date Feb 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip semiconductor apparatus with projecting electrodes and me...
- Patent number 6,452,280
- Issue date Sep 17, 2002
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical mounting structure having an elution preventive film
- Patent number 6,429,382
- Issue date Aug 6, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing mounting structure and mounting structure produ...
- Patent number 6,369,450
- Issue date Apr 9, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed-circuit board having projection electrodes and method for p...
- Patent number 6,300,576
- Issue date Oct 9, 2001
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device, mounting method of s...
- Patent number 6,284,640
- Issue date Sep 4, 2001
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part and a method of production thereof
- Patent number 6,154,940
- Issue date Dec 5, 2000
- Matsushita Electric Industrial Co., Ltd.
- Keiji Onishi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic part and a method of production thereof
- Patent number 5,920,142
- Issue date Jul 6, 1999
- Matsushita Electric Industrial Co., Ltd.
- Keiji Onishi
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140231981
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTING ELECTRONIC COMPONENTS, METHOD FOR FORMING BUM...
- Publication number 20110049218
- Publication date Mar 3, 2011
- PANASONIC CORPORATION
- Tsukasa SHIRAISHI
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD
- Publication number 20090085227
- Publication date Apr 2, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic Component Mounting Method and Electronic Component Mount...
- Publication number 20090049687
- Publication date Feb 26, 2009
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN MODULE AND METHOD FOR MANUFACTURING T...
- Publication number 20080304237
- Publication date Dec 11, 2008
- Tsukasa SHIRAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-CONTAINING MODULE AND MANUFACTURING METHOD THE...
- Publication number 20080298023
- Publication date Dec 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Rikiya Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD CONNECTION METHOD AND WIRING BOARD
- Publication number 20080283284
- Publication date Nov 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Masayoshi KOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Equipped with Semiconductor Chip and Method for Producing Same
- Publication number 20080265437
- Publication date Oct 30, 2008
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
TEST MARK STRUCTURE, SUBSTRATE SHEET LAMINATE, MULTILAYERED CIRCUIT...
- Publication number 20080186045
- Publication date Aug 7, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yoji UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for connecting electronic components, method for forming bum...
- Publication number 20080011402
- Publication date Jan 17, 2008
- Tsukasa Shiraishi
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR...
- Publication number 20070262447
- Publication date Nov 15, 2007
- Matsushita Electric Industrial Co., Ltd.
- Koichi HIRANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20060087020
- Publication date Apr 27, 2006
- Matsushita Electric Industrial Co., Ltd.
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device including a wiring board with a three-dimensio...
- Publication number 20040212075
- Publication date Oct 28, 2004
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and module of the same
- Publication number 20030094685
- Publication date May 22, 2003
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, mounting circuit board, method of producing t...
- Publication number 20030049425
- Publication date Mar 13, 2003
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing mounting structure and mounting structure produ...
- Publication number 20020072151
- Publication date Jun 13, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for semiconductor device, mounting method of s...
- Publication number 20010033032
- Publication date Oct 25, 2001
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-circuit board having projection electrodes and method for p...
- Publication number 20010029666
- Publication date Oct 18, 2001
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and module of the same
- Publication number 20010002727
- Publication date Jun 7, 2001
- Tsukasa Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS

Tsukasa Shiraishi

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Wiring board connection method

Circuit board, method for manufacturing the same, and semiconductor...

Method for connecting electronic components, method for forming bum...

Method for connecting electronic components, method for forming bum...

Electronic component mounting method and electronic component mount...

Package equipped with semiconductor chip and method for producing same

Semiconductor device, mounting circuit board, method of producing t...

Method of producing mounting structure and mounting structure produ...

Semiconductor device including wiring board with three dimensional...

Method for producing a printed-circuit board having projection elec...

Semiconductor device including a wiring board and semiconductor ele...

Flip chip semiconductor apparatus with projecting electrodes and me...

Electrical mounting structure having an elution preventive film

Method of producing mounting structure and mounting structure produ...

Printed-circuit board having projection electrodes and method for p...

Manufacturing method for semiconductor device, mounting method of s...

Electronic part and a method of production thereof

Electronic part and a method of production thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR CONNECTING ELECTRONIC COMPONENTS, METHOD FOR FORMING BUM...

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

Electronic Component Mounting Method and Electronic Component Mount...

ELECTRONIC COMPONENT BUILT-IN MODULE AND METHOD FOR MANUFACTURING T...

ELECTRONIC COMPONENT-CONTAINING MODULE AND MANUFACTURING METHOD THE...

WIRING BOARD CONNECTION METHOD AND WIRING BOARD

Package Equipped with Semiconductor Chip and Method for Producing Same

TEST MARK STRUCTURE, SUBSTRATE SHEET LAMINATE, MULTILAYERED CIRCUIT...

Method for connecting electronic components, method for forming bum...

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR...

Semiconductor device and method for producing the same

Circuit substrate for packaging semiconductor device, method for pr...

Semiconductor device including a wiring board with a three-dimensio...

Semiconductor device and module of the same

Semiconductor device, mounting circuit board, method of producing t...

Method of producing mounting structure and mounting structure produ...

Manufacturing method for semiconductor device, mounting method of s...

Printed-circuit board having projection electrodes and method for p...

Semiconductor device and module of the same