Tsung-Hsien Hsu

Person

Taichung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with shielding member and method of manufactu...
- Patent number 9,490,219
- Issue date Nov 8, 2016
- Siliconware Precision Industries Co., Ltd.
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield, package structure and semiconductor package having the shie...
- Patent number 9,257,394
- Issue date Feb 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Kuang-Neng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,963,299
- Issue date Feb 24, 2015
- Siliconware Precision Industries Co., Ltd.
- Chien-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,766,416
- Issue date Jul 1, 2014
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150333017
- Publication date Nov 19, 2015
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD, PACKAGE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SHIE...
- Publication number 20140312473
- Publication date Oct 23, 2014
- Kuang-Neng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, FABRICATION METHOD THEREOF AND MOLDING COMPOUND
- Publication number 20140264958
- Publication date Sep 18, 2014
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, FABRICATION METHOD THEREOF AND ADHESIVE COMPOUND
- Publication number 20140203771
- Publication date Jul 24, 2014
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Hsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130320513
- Publication date Dec 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Chien-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130234337
- Publication date Sep 12, 2013
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Tsung-Hsien Hsu

Person

Patents Grantslast 30 patents

Semiconductor package with shielding member and method of manufactu...

Shield, package structure and semiconductor package having the shie...

Semiconductor package and fabrication method thereof

Semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SHIELD, PACKAGE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SHIE...

SEMICONDUCTOR PACKAGE, FABRICATION METHOD THEREOF AND MOLDING COMPOUND

ELECTRONIC PACKAGE, FABRICATION METHOD THEREOF AND ADHESIVE COMPOUND

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF